Inventor

Shinro Ohta

Inventor

Tokyo, JP

Overview

2006–2019

Patent span

Performing operations

Primary field (CPC B)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary

B24BMachines, devices, or processes for grinding or polishing29%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%

G01BMeasuring length, thickness or similar linear dimensions14%

B24DTools for grinding, buffing or sharpening10%

G01NInvestigating or analysing materials by determining their chemical or physical properties10%

G05BControl or regulating systems in general10%

B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool5%

H01LSemiconductor devices5%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2006–2019Patents assigned to EBARA CORP (5)· patent assignee history

2006–2019Based in Tokyo, JP· patent location history

2013–2014Patents assigned to OHTA SHINRO (2)· patent assignee history

2013–2014Patents assigned to SHIGETA ATSUSHI (2)· patent assignee history

2013–2014Patents assigned to TOSHIBA KK (2)· patent assignee history

2013Patents assigned to KOBAYASHI YOICHI (1)· patent assignee history

Assignee and location history derived from the patent record.

Assignees

Locations

Location	Patents	Span
Tokyo, JP	6	2006–2019