Inventor

Saburo Miyamoto

Inventor

Mie, JP

Overview

19→

Patents

1980–2013

Patent span

Electricity

Primary field (CPC H)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%

Y10TTechnical subjects covered by former us classification18%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1010%

B29CShaping or joining of plastics8%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%

F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges4%

G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%

G06FElectric digital data processing4%

A61FFilters implantable into blood vessels2%

B08BCleaning in general2%

PatentTitleYear

8,395,595'Touch sensor, display device with touch sensor, and method of generating location data'2013 8,349,106'Adhesive tape joining method and adhesive tape joining apparatus'2013 8,097,121'Protective tape separation method and protective tape separation apparatus'2012 8,062,474'Protective tape separation method and apparatus using the same'2011 8,031,180'Touch sensor, display with touch sensor, and method for generating position data'2011 7,984,737'Adhesive tape cutting method and adhesive tape joining apparatus using the same'2011 7,913,735'Adhesive tape joining apparatus'2011 7,849,900'Apparatus for joining a separating adhesive tape'2010 7,393,757'Method for separating semiconductor wafer from supporting member, and apparatus using the same'2008 7,387,951'Method of dicing semiconductor wafer into chips, and apparatus using this method'2008 7,384,811'Method of separating semiconductor wafer, and separating apparatus using the same'2008 7,078,316'Substrate joining apparatus'2006 6,272,814'Method of packaging nut assemblies'2001 6,235,144'Resist removing apparatus and method'2001 6,099,675'Resist removing method'2000 5,891,298'Method and apparatus for peeling protective adhesive tape from semiconductor wafer'1999 5,759,006'Semiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewith'1998 5,688,090'Screw assembly'1997 4,204,905'Taping machine'1980

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1980–2001Based in Ibaraki, JP· patent location history

1997–2001Patents assigned to WAKAI SANGYO KK (2)· patent assignee history

1997–2001Based in Osaka, JP· patent location history

1998–2013Patents assigned to NITTO DENKO CORP (14)· patent assignee history

2006–2011Based in Mie, JP· patent location history

2011–2013Patents assigned to MIYAMOTO SABURO (4)· patent assignee history

2011–2013Patents assigned to YAMAMOTO MASAYUKI (3)· patent assignee history

2011–2013Patents assigned to SHARP KK (2)· patent assignee history

2011–2013Based in Kameyama, JP· patent location history

2011–2013Based in Soraku-gun, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
NITTO DENKO CORP	14	1998–2013
MIYAMOTO SABUROself	4	2011–2013
YAMAMOTO MASAYUKI	3	2011–2013
SHARP KK	2	2011–2013
WAKAI SANGYO KK	2	1997–2001

Locations

Location	Patents	Span
Mie, JP	6	2006–2011
Kameyama, JP	4	2011–2013
Ibaraki, JP	4	1980–2001
Soraku-gun, JP	2	2011–2013
Osaka, JP	2	1997–2001