Inventor
Mohammad Akhavain
Inventor
Escondido, CA, US
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B41Jprimary
B41JTypewriters38%
H05KPrinted circuits18%
Y10TTechnical subjects covered by former us classification15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B23KSoldering or unsoldering7%
H01RElectrically-conductive connections7%
Y02PClimate change mitigation technologies in the production or processing of goods2%
PatentTitleYear
7,480,994'Method of making a fluid ejection head for a fluid ejection device'20097,338,149'Methods for forming and protecting electrical interconnects and resultant assemblies'20087,211,736'Connection pad layouts'20077,188,925'Fluid ejection head assembly'20077,103,969'Methods and systems for forming a die package'20066,983,539'Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps'20066,951,778'Edge-sealed substrates and methods for effecting the same'20056,913,343'Methods for forming and protecting electrical interconnects and resultant assemblies'20056,843,552'Electrical circuit for printhead assembly'20056,705,705'Substrate for fluid ejection devices'20046,698,092'Methods and systems for forming a die package'20046,575,559'Joining of different materials of carrier for fluid ejection devices'20036,557,976'Electrical circuit for wide-array inkjet printhead assembly'20036,543,880'Inkjet printhead assembly having planarized mounting layer for printhead dies'20036,476,346'Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding'20026,450,614'Printhead die alignment for wide-array inkjet printhead assembly'20026,431,683'Hybrid carrier for wide-array inkjet printhead assembly'20026,428,141'Reference datums for inkjet printhead assembly'20026,409,307'Coplanar mounting of printhead dies for wide-array inkjet printhead assembly'20026,397,465'Connection of electrical contacts utilizing a combination laser and fiber optic push connect system'20026,350,013'Carrier positioning for wide-array inkjet printhead assembly'20026,236,015'Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding'20015,341,564'Method of fabricating integrated circuit module'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994Patents assigned to UNISYS CORP (1)· patent assignee history
1994–2002Based in San Diego, CA, US· patent location history
2001–2003Patents assigned to HEWLETT PACKARD CO (9)· patent assignee history
2001–2009Based in Escondido, CA, US· patent location history
2003–2009Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (13)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HEWLETT PACKARD DEVELOPMENT CO | 13 | 2003–2009 |
| HEWLETT PACKARD CO | 9 | 2001–2003 |
| UNISYS CORP | 1 | 1994 |
Locations
| Location | Patents | Span |
|---|---|---|
| Escondido, California, US | 21 | 2001–2009 |
| San Diego, California, US | 2 | 1994–2002 |