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Inventor

Chia-Chun Miao

Inventor
Taichung, TW

Overview

40→
Patents
2014–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 40 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices40%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation10%
H05KPrinted circuits4%
H10DInorganic electric semiconductor devices4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein2%
G06FElectric digital data processing2%
H04NPictorial communication, e.g. television1%
PatentTitleYear
11,101,238Surface mounting semiconductor components202110,985,117Solder ball protection in packages202110,971,463Interconnection structure including a metal post encapsulated by a joint material having concave outer surface202110,892,290Interconnect layer contact and method for improved packaged integrated circuit reliability202110,867,957Mechanisms for forming hybrid bonding structures with elongated bumps202010,761,385Liquid crystal on silicon panel having less diffraction202010,720,495Semiconductor device and manufacturing method thereof202010,510,689Solder ball protection in packages201910,418,408Curved image sensor using thermal plastic substrate material201910,347,563Barrier structures between external electrical connectors201910,297,627Chip scale package for an image sensor201910,269,588Integrated circuit underfill scheme201910,211,243Edge reflection reduction201910,163,846Mechanisms for forming hybrid bonding structures with elongated bumps201810,157,900Semiconductor structure and manufacturing method thereof201810,147,751Edge reflection reduction201810,049,990Solder ball protection in packages201810,037,959Semiconductor structure and manufacturing method thereof20189,966,404Edge reflection reduction20189,966,396High dynamic range image sensor with reduced sensitivity to high intensity light20189,953,966Semiconductor device and method of forming the same20189,941,240Semiconductor chip scale package and manufacturing method thereof20189,921,442'Method for forming an alignment layer of a liquid crystal display device and display device manufactured thereby'20189,806,045'Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface'20179,698,079'Barrier structures between external electrical connectors'20179,659,839'Barrier structures between external electrical connectors'20179,653,341'Semiconductor structure and manufacturing method thereof'20179,627,325'Package alignment structure and method of forming same'20179,608,023'Edge reflection reduction'20179,590,005'High dynamic range image sensor with reduced sensitivity to high intensity light'20179,559,071'Mechanisms for forming hybrid bonding structures with elongated bumps'20179,543,373'Semiconductor structure and manufacturing method thereof'20179,472,523'Semiconductor structure and manufacturing method thereof'20169,460,989'Interposer having a defined through via pattern'20169,355,924'Integrated circuit underfill scheme'20169,337,154'Semiconductor device and method of manufacturing the same'20169,263,405'Semiconductor device'20169,184,143'Semiconductor device with bump adjustment and manufacturing method thereof'20159,064,873'Singulated semiconductor structure'20158,664,768'Interposer having a defined through via pattern'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (6)· patent assignee history
2014Patents assigned to LIANG SHIH-WEI (1)· patent assignee history
2014–2017Based in Hsinchu, TW· patent location history
2015–2018Based in Hsinchu County, TW· patent location history
2016–2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (22)· patent assignee history
2016–2021Based in Taichung, TW· patent location history
2017–2021Patents assigned to OMNIVISION TECH INC (11)· patent assignee history
2017–2021Based in Sunnyvale, CA, US· patent location history
2017–2018Based in Santa Clara, CA, US· patent location history
2020Patents assigned to LIN ZHIQIANG (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD222016–2021
OMNIVISION TECH INC112017–2021
TAIWAN SEMICONDUCTOR MFG62014–2016
LIANG SHIH-WEI12014
LIN ZHIQIANG12020
Locations
LocationPatentsSpan
Taichung, TW202016–2021
Sunnyvale, California, US92017–2021
Hsinchu County, TW62015–2018
Hsinchu, TW32014–2017
Santa Clara, California, US22017–2018