Inventor
Yuji Morinaga
Inventor
Hanno, JP
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits10%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems7%
H10DInorganic electric semiconductor devices7%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
H01RElectrically-conductive connections3%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications3%
PatentTitleYear
10,615,092Electronic device202010,600,712Electronic device202010,461,042Semiconductor module201910,319,704Semiconductor module201910,251,256Heat dissipating structure201910,243,477Semiconductor device having a bypass capacitor201910,199,486Semiconductor device201910,159,166Heat dissipating structure201810,083,844Method of manufacturing bonded body20189,704,828'Semiconductor module'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2020Patents assigned to SHINDENGEN ELECTRIC MFG (10)· patent assignee history
2017–2020Based in Hanno, JP· patent location history
2018–2019Based in Saitama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINDENGEN ELECTRIC MFG | 10 | 2017–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hanno, JP | 7 | 2017–2020 |
| Saitama, JP | 3 | 2018–2019 |