Inventor
Hidemasa Kagii
Inventor
Takasaki, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1064%
B01DSeparation9%
B01FMixing, e.g. dissolving, emulsifying or dispersing9%
C02FTreatment of water, waste water, sewage, or sludge9%
C22FChanging the physical structure of non-ferrous metals and non-ferrous alloys9%
PatentTitleYear
8,492,202'Semiconductor device and method of manufacturing the same'20138,314,484'Semiconductor device and method of manufacturing the same'20127,579,677'Semiconductor device and method for manufacturing thereof'20097,528,489'Semiconductor apparatus and manufacturing method'20097,405,469'Semiconductor device and method of manufacturing the same'20087,374,965'Manufacturing method of semiconductor device'20087,220,617'Semiconductor device and method of manufacturing the same'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2009Patents assigned to RENESAS TECH CORP (5)· patent assignee history
2007–2013Based in Takasaki, JP· patent location history
2012–2013Patents assigned to RENESAS ELECTRONICS CORP (2)· patent assignee history
2012Patents assigned to ARAI KATSUO (1)· patent assignee history
2012Patents assigned to ISHII TOSHIAKI (1)· patent assignee history
2012Patents assigned to ITO KAZUTOSHI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RENESAS TECH CORP | 5 | 2007–2009 |
| RENESAS ELECTRONICS CORP | 2 | 2012–2013 |
| ARAI KATSUO | 1 | 2012 |
| ISHII TOSHIAKI | 1 | 2012 |
| ITO KAZUTOSHI | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Takasaki, JP | 7 | 2007–2013 |