LexDanaLexDanabeta
Inventor

Xiao Yang

Inventor
Cupertino, CA, US

Overview

51→
Patents
2002–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 51 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B81Bprimary
B81BMicrostructural devices or systems, e.g. micromechanical devices15%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%
G02BOptical elements, systems or apparatus12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
H10DInorganic electric semiconductor devices5%
G01CMeasuring distances, levels or bearings4%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
G06FElectric digital data processing4%
Y10TTechnical subjects covered by former us classification4%
PatentTitleYear
9,950,924Methods and structures of integrated MEMS-CMOS devices20189,709,509'System configured for integrated communication, MEMS, Processor, and applications using a foundry compatible semiconductor process'20179,684,814'Method and device for estimating orientation field of fingerprint'20179,440,846'System on a chip using integrated MEMS and CMOS devices'20169,305,203'Method for registering fingerprint image'20169,276,080'Methods and structures of integrated MEMS-CMOS devices'20169,006,878'Method and device for wafer scale packaging of optical devices using a scribe and break process'20158,928,696'Methods and apparatus for operating hysteresis on a hand held device'20158,869,616'Method and structure of an inertial sensor using tilt conversion'20148,823,007'Integrated system on chip using multiple MEMS and CMOS devices'20148,797,279'Analog touchscreen methods and apparatus'20148,794,065'Integrated inertial sensing apparatus using MEMS and quartz configured on crystallographic planes'20148,652,961'Methods and structure for adapting MEMS structures to form electrical interconnections for integrated circuits'20148,643,612'Touchscreen operation threshold methods and apparatus'20148,637,943'Multi-axis integrated MEMS devices with CMOS circuits and method therefor'20148,584,521'Accurate gyroscope device using MEMS and quartz'20138,486,723'Three axis magnetic sensor device and method'20138,476,084'Method and structure of sensors or electronic devices using vertical mounting'20138,421,082'Integrated CMOS and MEMS with air dielectric method and system'20138,395,252'Integrated MEMS and CMOS package and method'20138,367,522'Method and structure of integrated micro electro-mechanical systems and electronic devices using edge bond pads'20138,361,331'MEMS mirror system for laser printing applications'20138,324,047'Method and structure of an integrated CMOS and MEMS device using air dielectric'20128,288,851'Method and system for hermetically sealing packages for optics'20128,236,577'Foundry compatible process for manufacturing a magneto meter using lorentz force for integrated systems'20128,022,520'System for hermetically sealing packages for optics'20117,948,000'Method and system for hermetically sealing packages for optics'20117,898,561'MEMS mirror system for laser printing applications'20117,825,519'Method and device for wafer scale packaging of optical devices using a scribe and break process'20107,671,461'Method and system for hermetically sealing packages for optics'20107,542,195'Triple alignment substrate method and structure for packaging devices'20097,449,284'Method and structure for fabricating mechanical mirror structures using backside alignment techniques'20087,375,930'Apparatus for PZT actuation device for hard disk drives'20087,349,140'Triple alignment substrate method and structure for packaging devices'20087,344,956'Method and device for wafer scale packaging of optical devices using a scribe and break process'20087,303,645'Method and system for hermetically sealing packages for optics'20077,285,478'Method for micro-electromechanical system package'20077,265,027'Bond method and structure using selective application of spin on glass'20077,202,989'Method and device for fabricating a release structure to facilitate bonding of mirror devices onto a substrate'20077,199,918'Electrical contact method and structure for deflection devices formed in an array configuration'20077,160,791'Batch process and device for forming spacer structures for packaging optical reflection devices'20077,149,060'Actuation device and method for high density hard disk drive head'20067,141,870'Apparatus for micro-electro mechanical system package'20067,064,045'Laser based method and device for forming spacer structures for packaging optical reflection devices'20067,026,695'Method and apparatus to reduce parasitic forces in electro-mechanical systems'20066,952,478'Method and system for performing permutations using permutation instructions based on modified omega and flip stages'20056,922,472'Method and system for performing permutations using permutation instructions based on butterfly networks'20056,527,965'Method for fabricating improved mirror arrays for physical separation'20036,529,654'Method for transparent switching and controlling optical signals using mirror designs'20036,525,864'Integrated mirror array and circuit device'20036,407,844'Device for fabricating improved mirror arrays for physical separation'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2003Patents assigned to NAYNA NETWORKS INC (4)· patent assignee history
2002–2008Based in Fremont, CA, US· patent location history
2006–2015Patents assigned to MIRADIA INC (21)· patent assignee history
2006–2018Based in Cupertino, CA, US· patent location history
2006–2008Based in Sunnyvale, CA, US· patent location history
2012–2018Patents assigned to MCUBE INC (20)· patent assignee history
2012–2014Patents assigned to YANG XIAO CHARLES (11)· patent assignee history
2012–2014Based in Menlo Park, CA, US· patent location history
2014–2017Patents assigned to YANG XIAO “CHARLES” (7)· patent assignee history
2016–2017Based in Beijing, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MIRADIA INC212006–2015
MCUBE INC202012–2018
YANG XIAO CHARLESself112012–2014
YANG XIAO “CHARLES”self72014–2017
NAYNA NETWORKS INC42002–2003
Locations
LocationPatentsSpan
Cupertino, California, US352006–2018
Fremont, California, US62002–2008
Menlo Park, California, US32012–2014
Sunnyvale, California, US32006–2008
Beijing, CN22016–2017