Inventor
Telesphor Kamgaing
Inventor
Chandler, AZ, US
Overview
Patents· 109 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H01LSemiconductor devices16%
H01QAntennas, i.e. radio aerials12%
H04BTransmission8%
H01PWaveguides7%
Y10TTechnical subjects covered by former us classification5%
H03HImpedance networks, e.g. resonant circuits4%
H05KPrinted circuits4%
G06FElectric digital data processing3%
H04WWireless communication networks2%
PatentTitleYear
11,108,433Single side band transmission over a waveguide202111,107,781RFIC having coaxial interconnect and molded layer202111,109,428Blade computing system with wireless communication between blades within a blade enclosure202111,095,012Methods for conductively coating millimeter waveguides202111,062,947Inorganic dies with organic interconnect layers and related structures202111,056,765Microelectronic devices designed with foldable flexible substrates for high frequency communication modules202111,050,155Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems202111,037,892Substrate dielectric waveguides in semiconductor packages202111,031,666Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric202111,024,933Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer202111,011,470Microelectronic package with mold-integrated components202110,998,879Monolithic die with acoustic wave resonators and active circuitry202110,992,016Multiplexer and combiner structures embedded in a mmwave connector interface202110,992,017Semiconductor package comprising chiplets disposed on a substrate which are electromagnetically coupled by dielectric waveguides and a computing networks formed therefrom202110,992,021Cross talk and interference reduction for high frequency wireless interconnects202110,964,992Electromagnetic wave launcher including an electromagnetic waveguide, wherein a millimeter wave signal and a lower frequency signal are respectively launched at different portions of the waveguide202110,950,919System comprising first and second servers interconnected by a plurality of joined waveguide sections202110,951,248Radio frequency (RF) module with shared inductor202110,921,524Crimped mm-wave waveguide tap connector202110,910,305Microelectronic devices designed with capacitive and enhanced inductive bumps202110,903,818Piezoelectric package-integrated film bulk acoustic resonator devices202110,897,238Piezoelectric package-integrated contour mode filter devices202110,887,439Microelectronic devices designed with integrated antennas on a substrate202110,886,606Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systems202110,868,357Massive antenna array architecture for base stations designed for high frequency communications202010,852,495Microelectronic package communication using radio interfaces connected through wiring202010,847,889Patch antenna with isolated feeds202010,819,445Waveguide and transceiver interference mitigation202010,804,227Semiconductor packages with antennas202010,777,538System on package architecture including structures on die back side202010,734,735Distributed on-package millimeter-wave radio202010,734,236Electronic devices with components formed by late binding using self-assembled monolayers202010,680,788Waveguide communication with increased link data rate202010,658,312Embedded millimeter-wave phased array module202010,629,551Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric202010,623,106Orthogonal frequency division multiplexing single sideband transmission over a waveguide202010,615,133Die package with superposer substrate for passive components202010,594,294Piezoelectric package-integrated delay lines202010,593,636Platform with thermally stable wireless interconnects202010,595,410Non-planar on-package via capacitor202010,573,608Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package202010,566,672Waveguide connector with tapered slot launcher202010,546,835Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric202010,498,379Wireless interconnects on flexible cables between computing platforms201910,484,120Waveguide couplers and junctions to enable frequency division multiplexed sensor systems in autonomous vehicle201910,477,596Blade computing system with wireless communication between blades within a blade enclosure201910,476,545Communication between integrated circuit packages using a millimeter-wave wireless radio fabric201910,468,737Assembly and manufacturing friendly waveguide launchers201910,461,388Millimeter wave fabric network over dielectric waveguides201910,452,571Microelectronic package communication using radio interfaces connected through waveguides201910,453,804Radio die package with backside conductive plate201910,439,671Microelectronic devices designed with high frequency communication modules having steerable beamforming capability201910,432,167Piezoelectric package-integrated crystal devices201910,410,983Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on package201910,404,499Dispersion compensation for waveguide communication channels201910,327,268Microelectronic package with wireless interconnect201910,326,211Distributed on-package millimeter-wave radio201910,304,686Electronic devices with components formed by late binding using self-assembled monolayers201910,304,804System on package architecture including structures on die back side201910,291,283Tunable radio frequency systems using piezoelectric package-integrated switching devices201910,277,322Channelization for dispersion limited waveguide communication channels201910,263,312Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards201910,263,346Single-package phased array module with interleaved sub-arrays201910,256,286Integrated inductor for integrated circuit devices201910,256,521Waveguide connector with slot launcher201910,249,925Dielectric waveguide bundle including a supporting feature for connecting first and second server boards201910,211,970Millimeter wave CMOS engines for waveguide fabrics201910,147,997Integration of millimeter wave antennas on microelectronic substrates201810,128,177Multi-layer package with integrated antenna201810,083,923Platform with thermally stable wireless interconnects201810,079,668Waveguide communication with increased link data rate201810,057,796Dual polarized antenna array201810,033,093mmWave antennas and transmission lines on standard substrate materials201810,032,052Piezoelectric package-integrated delay lines for radio frequency identification tags20189,960,849Channelization for dispersion limited waveguide communication channels20189,921,640'Integrated voltage regulators with magnetically enhanced inductors'20189,881,990'Integrated inductor for integrated circuit devices'20189,853,359Antenna integrated in a package substrate20179,820,384'Flexible electronic assembly method'20179,786,581'Through-silicon via (TSV)-based devices and associated techniques and configurations'20179,773,742'Embedded millimeter-wave phased array module'20179,673,268'Integrated inductor for integrated circuit devices'20179,659,904'Distributed on-package millimeter-wave radio'20179,653,805'Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates'20179,647,636'Piezoelectric package-integrated delay lines for radio frequency identification tags'20179,620,847'Integration of millimeter wave antennas on microelectronic substrates'20179,543,244'Hybrid package transmission line circuits'20179,505,610'Device, system and method for providing MEMS structures of a semiconductor package'20169,419,339'Package structures including discrete antennas assembled on a device'20169,413,079'Single-package phased array module with interleaved sub-arrays'20169,406,427'Transformer devices'20169,318,952'Series and parallel hybrid switched capacitor networks for IC power delivery'20169,229,466'Fully integrated voltage regulators for multi-stack integrated circuit architectures'20169,166,284'Package structures including discrete antennas assembled on a device'20158,901,688'High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making same'20148,890,302'Hybrid package transmission line circuits'20148,816,906'Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substrates'20148,804,366'Package-based filtering and matching solutions'20148,759,950'Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making same'20148,710,903'Drive and startup for a switched capacitor divider'20148,582,333'Integration of switched capacitor networks for power delivery'20138,558,636'Package embedded equalizer'20138,330,436'Series and parallel hybrid switched capacitor networks for IC power delivery'20128,111,521'Package-based filtering and matching solutions'20127,841,070'Method of fabricating a transformer device'20107,760,140'Multiband antenna array using electromagnetic bandgap structures'20107,626,472'Package embedded three dimensional balun'20097,548,138'Compact integration of LC resonators'20097,262,674'Bandpass filter having first and second serially coupled collection of filter components for providing upper and lower rejection notches'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2021Patents assigned to INTEL CORP (109)· patent assignee history
2007–2021Based in Chandler, AZ, US· patent location history
2012–2019Patents assigned to KAMGAING TELESPHOR (18)· patent assignee history
2012–2014Patents assigned to DAVIES-VENN EMILE (2)· patent assignee history
2014–2017Patents assigned to RAO VALLURI R (3)· patent assignee history
2017–2019Patents assigned to ELSHERBINI ADEL A (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 109 | 2007–2021 |
| KAMGAING TELESPHORself | 18 | 2012–2019 |
| ELSHERBINI ADEL A | 3 | 2017–2019 |
| RAO VALLURI R | 3 | 2014–2017 |
| DAVIES-VENN EMILE | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 109 | 2007–2021 |