Inventor
Ruzaini B. Ibrahim
Inventor
Puncak Alam, MY
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1056%
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
PatentTitleYear
9,305,898'Semiconductor device with combined power and ground ring structure'20169,064,838'Heat spreader for integrated circuit device'20158,981,541'Quad flat semiconductor device with additional contacts'20158,012,799'Method of assembling semiconductor device with heat spreader'20117,432,130'Method of packaging semiconductor die without lead frame or substrate'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2016Patents assigned to FREESCALE SEMICONDUCTOR INC (5)· patent assignee history
2008Based in Selangor, MY· patent location history
2011–2016Based in Puncak Alam, MY· patent location history
2015–2016Patents assigned to IBRAHIM RUZAINI B (3)· patent assignee history
2015–2016Patents assigned to TIU KONG BEE (2)· patent assignee history
2015Patents assigned to IBRAHIM MOHD RUSLI (1)· patent assignee history
2015Based in Bandar, MY· patent location history
2016Patents assigned to KOH WEN SHI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FREESCALE SEMICONDUCTOR INC | 5 | 2008–2016 |
| IBRAHIM RUZAINI Bself | 3 | 2015–2016 |
| TIU KONG BEE | 2 | 2015–2016 |
| IBRAHIM MOHD RUSLI | 1 | 2015 |
| KOH WEN SHI | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Puncak Alam, MY | 3 | 2011–2016 |
| Bandar, MY | 1 | 2015 |
| Selangor, MY | 1 | 2008 |