Inventor

Adam M. Wolski

Inventor

Edgewater, NJ, US

Overview

1976–2002

Patent span

Electricity

Primary field (CPC H)

Patents· 14 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits35%

C25DProcesses for the electrolytic or electrophoretic production of coatings30%

Y10TTechnical subjects covered by former us classification23%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%

PatentTitleYear

6,372,113'Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same'2002 6,270,645'Simplified process for production of roughened copper foil'2001 6,270,648'Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil'2001 6,224,991'Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such process'2001 5,989,727'Electrolytic copper foil having a modified shiny side'1999 5,863,410'Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby'1999 5,834,140'Electrodeposited copper foil for fine pattern and method for producing the same'1998 5,447,619'Copper foil for the manufacture of printed circuit boards and method of producing the same'1995 5,215,646'Low profile copper foil and process and apparatus for making bondable metal foils'1993 5,207,889'Method of producing treated copper foil, products thereof and electrolyte useful in such method'1993 4,915,797'Continuous process for coating printed circuit grade copper foil with a protective resin'1990 4,572,768'Treatment for copper foil'1986 RE030180'Plural copper-layer treatment of copper foil and article made thereby'1979 3,998,601'Thin foil'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976–1990Patents assigned to YATES INDUSTRIES (2)· patent assignee history

1976–2002Based in Edgewater, NJ, US· patent location history

1986Patents assigned to SQUARE D CO (1)· patent assignee history

1993–2001Patents assigned to CIRCUIT FOIL USA INC (6)· patent assignee history

1998Patents assigned to CIRCUIT FOIL JAPAN (1)· patent assignee history

2001–2002Patents assigned to YATES FOIL USA INC (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
CIRCUIT FOIL USA INC	6	1993–2001
YATES FOIL USA INC	3	2001–2002
YATES INDUSTRIES	2	1976–1990
CIRCUIT FOIL JAPAN	1	1998
SQUARE D CO	1	1986

Locations

Location	Patents	Span
Edgewater, New Jersey, US	14	1976–2002