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Inventor

Seung-won Lim

Inventor
Bucheon-si, KR

Overview

20→
Patents
2003–2014
Patent span
Electricity
Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1059%
H05KPrinted circuits15%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems6%
Y10TTechnical subjects covered by former us classification6%
B09BDisposal of solid waste not otherwise provided for3%
C10GCracking hydrocarbon oils3%
H01LSemiconductor devices3%
H10NElectric solid-state devices not otherwise provided for3%
Y02WClimate change mitigation technologies related to wastewater treatment or waste management3%
PatentTitleYear
8,796,831'Complex semiconductor packages and methods of fabricating the same'20148,766,419'Power module having stacked flip-chip and method of fabricating the power module'20148,604,606'Heat sink package'20138,552,541'Power device packages having thermal electric modules using peltier effect and methods of fabricating the same'20138,350,369'High power semiconductor package'20138,258,622'Power device package and semiconductor package mold for fabricating the same'20127,986,531'Power system module and method of fabricating the same'20117,951,645'Power module for low thermal resistance and method of fabricating the same'20117,863,725'Power device packages and methods of fabricating the same'20117,847,395'Package and package assembly of power device'20107,808,103'Leadless package'20107,786,570'Heat sink package'20107,714,428'High power semiconductor package and method of making the same'20107,706,146'Power system module and method of fabricating the same'20107,701,048'Power module for low thermal resistance and method of fabricating the same'20107,687,903'Power module and method of fabricating the same'20107,675,148'Power module having stacked flip-chip and method of fabricating the power module'20107,501,700'Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same'20097,449,774'Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same'20086,574,107'Stacked intelligent power module package'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2014Patents assigned to FAIRCHILD KR SEMICONDUCTOR LTD (20)· patent assignee history
2003–2009Based in Anyang, KR· patent location history
2010–2014Based in Bucheon-si, KR· patent location history
2012–2014Patents assigned to LIM SEUNG-WON (5)· patent assignee history
2012–2013Patents assigned to LEE KEUN-HYUK (2)· patent assignee history
2012–2013Patents assigned to PARK SUNG-MIN (2)· patent assignee history
2012–2014Based in Gyeonggi-do, KR· patent location history
2013–2014Patents assigned to JEON O-SEOB (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FAIRCHILD KR SEMICONDUCTOR LTD202003–2014
LIM SEUNG-WONself52012–2014
JEON O-SEOB22013–2014
LEE KEUN-HYUK22012–2013
PARK SUNG-MIN22012–2013
Locations
LocationPatentsSpan
Bucheon-si, KR142010–2014
Gyeonggi-do, KR32012–2014
Anyang, KR32003–2009