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Inventor

Minakshisundaran Balasubramanian Anand

Inventor
Yokohama, JP

Overview

18→
Patents
1999–2012
Patent span
Electricity
Primary field (CPC H)

Patents· 18 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
G06FElectric digital data processing13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
G05BControl or regulating systems in general6%
H04LTransmission of digital information, e.g. telegraphic communication6%
H04WWireless communication networks6%
H10DInorganic electric semiconductor devices6%
G01DMeasuring not specially adapted for a specific variable3%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications3%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use3%
PatentTitleYear
8,295,295'System and method for automatically segmenting and merging routing domains within networks'20128,271,937'System and method for automating generation of an automated sensor network'20128,164,481'System and method for conducting bi-directional communication sessions with utility meters from a mobile device'20127,346,891'System and method for automating generation of an automated sensor network'20087,093,206'Computer aided design method and apparatus for modeling and analyzing on-chip interconnect structures'20067,035,207'System and method for forming, maintaining and dynamic reconfigurable routing in an ad-hoc network'20066,734,096'Fine-pitch device lithography using a sacrificial hardmask'20046,720,658'Semiconductor device having a plurality of conductive layers'20046,500,748'Semiconductor device and method of manufacturing the same'20026,368,951'Semiconductor device manufacturing method and semiconductor device'20026,362,528'Semiconductor device and method of manufacturing the same'20026,307,265'Feasible, gas-dielectric interconnect process'20016,306,753'Feasible, gas-dielectric interconnect process'20016,291,891'Semiconductor device manufacturing method and semiconductor device'20016,253,362'Method of designing dummy wiring'20016,037,247'Method of manufacturing semiconductor device having a self aligned contact'20005,982,040'Semiconductor device and method for manufacturing the same'19995,966,634'Method of manufacturing semiconductor device having multi-layer wiring structure with diffusion preventing film'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2004Patents assigned to TOSHIBA KK (11)· patent assignee history
1999–2004Based in Yokohama, JP· patent location history
2004–2006Patents assigned to IBM (2)· patent assignee history
2004–2012Based in Germantown, MD, US· patent location history
2006–2008Patents assigned to EKA SYSTEMS INC (2)· patent assignee history
2012Patents assigned to COOPER TECHNOLOGIES CO (3)· patent assignee history
2012Patents assigned to ANAND MINAKSHISUNDARAN BALASUBRAMANIAN (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK111999–2004
COOPER TECHNOLOGIES CO32012
ANAND MINAKSHISUNDARAN BALASUBRAMANIANself22012
EKA SYSTEMS INC22006–2008
IBM22004–2006
Locations
LocationPatentsSpan
Yokohama, JP111999–2004
Germantown, Maryland, US72004–2012