Inventor
Kim J. Blackwell
Inventor
Owego, NY, US
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
C23CCoating metallic material17%
Y10TTechnical subjects covered by former us classification17%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
B29CShaping or joining of plastics4%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
H01JElectric discharge tubes or discharge lamps2%
PatentTitleYear
7,800,916'Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same'20107,213,336'Hyperbga buildup laminate'20076,879,492'Hyperbga buildup laminate'20056,703,704'Stress reducing stiffener ring'20046,518,516'Multilayered laminate'20036,337,004'High adhesion performance roll sputtered strike layer'20026,284,329'Method of forming adherent metal components on a polyimide substrate'20016,235,411'Process for coating a substrate with metallic layer'20016,194,076'Method of forming adherent metal components on a polyimide substrate'20015,766,499'Method of making a circuitized substrate'19985,525,369'Method for metallizing through holes in thin film substrates, and resulting devices'19965,461,203'Electronic package including lower water content polyimide film'19955,372,848'Process for creating organic polymeric substrate with copper'19945,288,541'Method for metallizing through holes in thin film substrates, and resulting devices'19944,508,612'Shield for improved magnetron sputter deposition into surface recesses'1985Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1985–2007Patents assigned to IBM (14)· patent assignee history
1985–2010Based in Owego, NY, US· patent location history
2010Patents assigned to ENDICOTT INTERCONNECT TECH INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 14 | 1985–2007 |
| ENDICOTT INTERCONNECT TECH INC | 1 | 2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Owego, New York, US | 15 | 1985–2010 |