Inventor
Frieder Haag
Inventor
Wannweil, DE
Overview
Patents· 32 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems10%
B81BMicrostructural devices or systems, e.g. micromechanical devices9%
LOC109%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure5%
H01LSemiconductor devices5%
H05KPrinted circuits5%
Y10TTechnical subjects covered by former us classification5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
B01LChemical or physical laboratory apparatus for general use3%
PatentTitleYear
D0918751Remote for a display and operating device2021D0903536Bicycle stem2020D0885222Combined display and operating device2020D0877637Combined display and operating device2020D0877636Combined display and operating device2020D0843867Remote controller for an operating device with display2019D0842737Remote controller for an operating device with display2019D0842149Operating device with display20199,885,626'Micromechanical sensor system and corresponding manufacturing method'20189,101,929'Microfluidic system for purposes of analysis and diagnosis and corresponding method for producing a microfluidic system'20158,993,356'Method for constructing an electrical circuit, and electrical circuit'20158,835,222'Method for producing a two-chip assembly and corresponding two-chip assembly'20148,794,074'Sensor module and method for producing a sensor module'20148,759,988'Method for producing semiconductor components, and corresponding semiconductor component'20148,631,813'Method for producing a microfluidic system'20148,405,210'Method for producing a plurality of chips and a chip produced accordingly'20138,389,327'Method for manufacturing chips'20138,198,130'Chip module and method for producing a chip module having plains of extensions for chip and substrate'20127,939,937'Chip housing having reduced induced vibration'20117,855,426'Optical sensor assemblage and corresponding manufacturing method'20107,838,981'Component assembly'20107,825,524'QFN housing having optimized connecting surface geometry'20107,791,891'Enclosure including an electrical module'20107,737,544'Sensor system having a substrate and a housing, and method for manufacturing a sensor system'20106,955,975'Method for joining a silicon plate to a second plate'20056,872,911'Welding method'20056,804,883'Method for producing a pressure sensor'20046,778,400'Electronic device'20046,750,479'Semiconductor component and a method for identifying a semiconductor component'20046,711,033'Sealed housing for an electronic device and the respective seal'20046,528,868'Lead frame device and method for producing the same'20036,300,169'Method for manufacturing a pressure sensor'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2021Patents assigned to BOSCH GMBH ROBERT (32)· patent assignee history
2001–2004Based in Reutlingen, DE· patent location history
2004–2021Based in Wannweil, DE· patent location history
2012–2015Patents assigned to HAAG FRIEDER (9)· patent assignee history
2013Patents assigned to BENZEL HUBERT (2)· patent assignee history
2014–2015Patents assigned to BRUENDEL MATHIAS (4)· patent assignee history
2014–2015Patents assigned to SCHOLZ ULRIKE (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| BOSCH GMBH ROBERT | 32 | 2001–2021 |
| HAAG FRIEDERself | 9 | 2012–2015 |
| BRUENDEL MATHIAS | 4 | 2014–2015 |
| SCHOLZ ULRIKE | 3 | 2014–2015 |
| BENZEL HUBERT | 2 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Wannweil, DE | 29 | 2004–2021 |
| Reutlingen, DE | 3 | 2001–2004 |