Inventor

Chiu H. Ting

Inventor

Saratoga, CA, US

Overview

34→

Patents

1976–2005

Patent span

Electricity

Primary field (CPC H)

Patents· 34 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%

C25DProcesses for the electrolytic or electrophoretic production of coatings14%

C23CCoating metallic material9%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%

C25FProcesses for the electrolytic removal of materials from objects5%

G11CStatic stores4%

B05CApparatus for applying fluent materials to surfaces, in general3%

H10DInorganic electric semiconductor devices3%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%

PatentTitleYear

6,939,403'Spatially-arranged chemical processing station'2005 6,911,067'Solution composition and method for electroless deposition of coatings free of alkali metals'2005 6,902,605'Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper'2005 6,794,288'Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation'2004 6,492,722'Metallized interconnection structure'2002 6,402,592'Electrochemical methods for polishing copper films on semiconductor substrates'2002 6,365,025'Method for depositing and/or removing material on a substrate'2002 6,271,591'Copper-aluminum metallization'2001 6,187,152'Multiple station processing chamber and method for depositing and/or removing material on a substrate'2001 6,183,611'Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrate'2001 6,179,982'Introducing and reclaiming liquid in a wafer processing chamber'2001 6,153,521'Metallized interconnection structure and method of making the same'2000 6,077,412'Rotating anode for a wafer processing chamber'2000 6,022,465'Apparatus and method utilizing an electrode adapter for customized contact placement on a wafer'2000 6,017,437'Process chamber and method for depositing and/or removing material on a substrate'2000 6,017,820'Integrated vacuum and plating cluster system'2000 5,997,712'Copper replenishment technique for precision copper plating system'1999 5,972,192'Pulse electroplating copper or copper alloys'1999 5,969,422'Plated copper interconnect structure'1999 5,913,147'Method for fabricating copper-aluminum metallization'1999 5,891,513'Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications'1999 5,856,705'Sealed semiconductor chip and process for fabricating sealed semiconductor chip'1999 5,830,805'Electroless deposition equipment or apparatus and method of performing electroless deposition'1998 5,824,599'Protected encapsulation of catalytic layer for electroless copper interconnect'1998 5,742,094'Sealed semiconductor chip'1998 5,695,810'Use of cobalt tungsten phosphide as a barrier material for copper metallization'1997 5,674,787'Selective electroless copper deposited interconnect plugs for ULSI applications'1997 5,300,461'Process for fabricating sealed semiconductor chip using silicon nitride passivation film'1994 5,183,795'Fully planar metalization process'1993 5,169,680'Electroless deposition for IC fabrication'1992 4,885,262'Chemical modification of spin-on glass for improved performance in IC fabrication'1989 4,700,454'Process for forming MOS transistor with buried oxide regions for insulation'1987 4,654,958'Process for forming isolated silicon regions and field-effect devices on a silicon substrate'1987 3,934,057'High sensitivity positive resist layers and mask formation process'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976Based in Hopewell Junction, NY, US· patent location history

1987–1999Patents assigned to INTEL CORP (13)· patent assignee history

1987–2005Based in Saratoga, CA, US· patent location history

1997–1999Patents assigned to SEMATECH INC (5)· patent assignee history

1997–1999Patents assigned to CORNELL RES FOUNDATION INC (4)· patent assignee history

1999–2002Patents assigned to ADVANCED MICRO DEVICES INC (6)· patent assignee history

1999–2000Patents assigned to CUTEK RESEARCH INC (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
INTEL CORP	13	1987–1999
ADVANCED MICRO DEVICES INC	6	1999–2002
CUTEK RESEARCH INC	5	1999–2000
SEMATECH INC	5	1997–1999
CORNELL RES FOUNDATION INC	4	1997–1999

Locations

Location	Patents	Span
Saratoga, California, US	33	1987–2005
Hopewell Junction, New York, US	1	1976