Inventor
Michael W. Morrison
Inventor
Boise, ID, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering10%
C03BManufacture, shaping, or supplementary processes7%
G06KGraphical data reading7%
H01RElectrically-conductive connections7%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry3%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables3%
C03CChemical composition of glasses, glazes or vitreous enamels3%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds3%
PatentTitleYear
D0652211'Snap-on accessory holder for golf bag'20127,804,168'Ball grid array structures having tape-based circuitry'20107,709,915'Microelectronic devices having an EMI shield and associated systems and methods'20107,663,224'Semiconductor BGA package having a segmented voltage plane'20107,662,866'Polymeric support having novel pore structures'20107,501,313'Method of making semiconductor BGA package having a segmented voltage plane'20097,378,736'Ball grid array structures having tape-based circuitry'20087,323,772'Ball grid array structures and tape-based method of manufacturing same'20087,233,064'Semiconductor BGA package having a segmented voltage plane and method of making'20076,970,359'Reduced-sized memory card package, length-extending adaptor and method of forming adaptor'20056,865,086'Apparatus and method to secure an adaptor to a reduced-sized memory card'20056,861,348'Pre-pattern surface modification of low-k dielectrics'20056,720,247'Pre-pattern surface modification for low-k dielectrics using A H2 plasma'20046,065,310'High throughput glass fiberizing system and process'20004,440,557'Method and apparatus for forming and collecting continuous glass filaments'19844,349,364'Multiple orifice bushing'1982Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1982–1984Patents assigned to OWENS CORNING FIBERGLASS CORP (2)· patent assignee history
1982–2000Based in Newark, OH, US· patent location history
2004–2005Patents assigned to TEXAS INSTRUMENTS INC (2)· patent assignee history
2004–2005Based in Tempe, AZ, US· patent location history
2005–2010Patents assigned to MICRON TECHNOLOGY INC (8)· patent assignee history
2005–2010Based in Boise, ID, US· patent location history
2010Patents assigned to APTINA IMAGING CORP (1)· patent assignee history
2010Patents assigned to GE HEALTHCARE BIO SCIENCES AB (1)· patent assignee history
2010Based in Solna, SE· patent location history
2012Based in Fort Worth, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 8 | 2005–2010 |
| OWENS CORNING FIBERGLASS CORP | 2 | 1982–1984 |
| TEXAS INSTRUMENTS INC | 2 | 2004–2005 |
| APTINA IMAGING CORP | 1 | 2010 |
| GE HEALTHCARE BIO SCIENCES AB | 1 | 2010 |
Locations
| Location | Patents | Span |
|---|---|---|
| Boise, ID, US | 9 | 2005–2010 |
| Newark, OH, US | 3 | 1982–2000 |
| Tempe, AZ, US | 2 | 2004–2005 |
| Fort Worth, Texas, US | 1 | 2012 |
| Solna, SE | 1 | 2010 |