Inventor
Eisuke Tanaka
Inventor
Itami, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
C23CCoating metallic material11%
PatentTitleYear
6,130,481'Semiconductor integrated circuit interconnection structures and method of making the interconnection structures'20005,712,509'Semiconductor integrated circuit interconnection structures'19984,913,090'Chemical vapor deposition apparatus having cooling heads adjacent to gas dispersing heads in a single chamber'19904,884,120'Semiconductor device and method for making the same'19894,731,516'Laser polishing semiconductor wafer'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–2000Patents assigned to MITSUBISHI ELECTRIC CORP (5)· patent assignee history
1988–2000Based in Itami, JP· patent location history
1989Based in Hyogo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 5 | 1988–2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Itami, JP | 4 | 1988–2000 |
| Hyogo, JP | 1 | 1989 |