Inventor
Farshad Ghahghahi
Inventor
Los Gatos, CA, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1046%
H05KPrinted circuits23%
Y10TTechnical subjects covered by former us classification9%
H01LSemiconductor devices6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
G01RMeasuring electric variables3%
G06FElectric digital data processing3%
H01PWaveguides3%
H01RElectrically-conductive connections3%
PatentTitleYear
10,903,168Multi-RDL structure packages and methods of fabricating the same202110,672,712Multi-RDL structure packages and methods of fabricating the same20207,405,946'Ball grid array assignment'20087,345,245'Robust high density substrate design for thermal cycling reliability'20087,319,272'Ball assignment system'20087,105,926'Routing scheme for differential pairs in flip chip substrates'20067,081,672'Substrate via layout to improve bias humidity testing reliability'20067,051,434'Designing a ball assignment for a ball grid array package'20066,946,866'Measurement of package interconnect impedance using tester and supporting tester'20056,825,066'Stiffener design'20046,762,366'Ball assignment for ball grid array package'20046,671,865'High density input output'20036,531,932'Microstrip package having optimized signal line impedance control'20036,479,319'Contact escape pattern'20026,459,049'High density signal routing'20026,407,462'Irregular grid bond pad layout arrangement for a flip chip package'20026,150,729'Routing density enhancement for semiconductor BGA packages and printed wiring boards'20006,115,910'Misregistration fidutial'20006,114,761'Thermally-enhanced flip chip IC package with extruded heatspreader'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2008Patents assigned to LSI LOGIC CORP (17)· patent assignee history
2000–2008Based in Los Gatos, CA, US· patent location history
2000–2021Based in San Jose, CA, US· patent location history
2020–2021Patents assigned to ADVANCED MICRO DEVICES INC (2)· patent assignee history
2020Patents assigned to BHAGAVAT MILIND S (1)· patent assignee history
2020Patents assigned to FU LEI (1)· patent assignee history
2020Patents assigned to GHAHGHAHI FARSHAD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LSI LOGIC CORP | 17 | 2000–2008 |
| ADVANCED MICRO DEVICES INC | 2 | 2020–2021 |
| BHAGAVAT MILIND S | 1 | 2020 |
| FU LEI | 1 | 2020 |
| GHAHGHAHI FARSHADself | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Los Gatos, California, US | 16 | 2000–2008 |
| San Jose, California, US | 3 | 2000–2021 |