Inventor
Jason R. Eagle
Inventor
Kasson, MN, US
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
Y10TTechnical subjects covered by former us classification13%
H01LSemiconductor devices11%
G06FElectric digital data processing9%
H01RElectrically-conductive connections9%
F16BDevices for fastening or securing constructional elements or machine parts together, e.g. nails, bolts, circlips, clamps, clips or wedges4%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
B21DWorking or processing of sheet metal or metal tubes, rods or profiles without essentially removing material2%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding2%
PatentTitleYear
10,978,313Fixture facilitating heat sink fabrication202110,903,593Off the module cable assembly202110,779,391Integrated circuit device assembly202010,705,134High speed chip substrate test fixture202010,167,892Captive externally threaded fastener201910,109,975Module placement apparatus20189,913,361'Integrated circuit device assembly'20189,822,811'Captive externally threaded fastener method'20179,265,157'Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint'20168,867,205'Fluid cooling system and associated fitting assembly for electronic component'20148,747,122'Implementing connection of two large electronic boards utilizing LGA interconnect'20148,456,833'Fluid cooling system and associated fitting assembly for electronic component'20138,385,067'In-line memory and circuit board cooling system'20138,363,404'Implementing loading and heat removal for hub module assembly'20137,777,329'Heatsink apparatus for applying a specified compressive force to an integrated circuit device'20107,701,720'Electronic assembly and techniques for installing a heatsink in an electronic assembly'20107,488,192'Apparatus and method that minimizing dimensional instability and solder stress in surface mounted interconnections'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009–2021Patents assigned to IBM (17)· patent assignee history
2009–2019Based in Kasson, MN, US· patent location history
2013–2014Patents assigned to EAGLE JASON R (4)· patent assignee history
2013–2014Patents assigned to COLBERT JOHN L (2)· patent assignee history
2013Patents assigned to ARVELO AMILCAR (1)· patent assignee history
2014Patents assigned to BANITT TERRY F (1)· patent assignee history
2020–2021Based in Mantorville, MN, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 17 | 2009–2021 |
| EAGLE JASON Rself | 4 | 2013–2014 |
| COLBERT JOHN L | 2 | 2013–2014 |
| ARVELO AMILCAR | 1 | 2013 |
| BANITT TERRY F | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kasson, Minnesota, US | 13 | 2009–2019 |
| Mantorville, Minnesota, US | 4 | 2020–2021 |