Inventor
THOMAS BRUNSCHWILER
Inventor
CH
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
B22FWorking metallic powder7%
B23KSoldering or unsoldering7%
G06FElectric digital data processing7%
G06NComputing arrangements based on specific computational models7%
G06VImage or video recognition or understanding7%
H01FMagnets7%
H10DInorganic electric semiconductor devices7%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
11,967,548Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly202411,880,755Semi-supervised learning with group constraints202411,251,160Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask202211,235,404Personalized copper block for selective solder removal202211,164,804Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste202111,158,450Particle-based, anisotropic composite materials for magnetic cores2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to IBM (6)· patent assignee history
2021–2024Based in CH· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 6 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| CH | 6 | 2021–2024 |