Inventor
Daigo Yamaguchi
Inventor
Toyama, JP
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material27%
H01LSemiconductor devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
PatentTitleYear
10,784,116Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium20209,831,083Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium20179,111,748'Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer readable recording medium'2015Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2015–2020Patents assigned to HITACHI INT ELECTRIC INC (3)· patent assignee history
2015–2020Based in Toyama, JP· patent location history
2020Patents assigned to KOKUSAI ELECTRIC CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI INT ELECTRIC INC | 3 | 2015–2020 |
| KOKUSAI ELECTRIC CORP | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyama, JP | 3 | 2015–2020 |