Inventor
MAHESH WAGH
Inventor
US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Fprimary
G06FElectric digital data processing29%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use18%
H04LTransmission of digital information, e.g. telegraphic communication10%
H01LSemiconductor devices4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
B25JManipulators2%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors2%
G02BOptical elements, systems or apparatus2%
G05DSystems for controlling or regulating non-electric variables2%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes2%
PatentTitleYear
12,554,672Link layer-PHY interface adapter202612,457,271System, apparatus and method for handling multi-protocol traffic in data link layer circuitry202512,386,768Extending multichip package link off package202512,222,881Logical physical layer interface specification support for PCie 6.0, cxl 3.0, and UPI 3.0 protocols202512,001,353System, apparatus and method for synchronizing multiple virtual link states over a package interconnect202411,971,841Link layer-PHY interface adapter202411,797,378Multichip package link error detection202311,726,939Flex bus protocol negotiation and enabling sequence202311,729,096Techniques to support multiple protocols between computer system interconnects202311,663,154Virtualized link states of multiple protocol layer package interconnects202311,442,876System, apparatus and method for synchronizing multiple virtual link states over a package interconnect202211,386,033Extending multichip package link off package202211,307,928Multichip package link error detection202211,308,018Virtualized link states of multiple protocol layer package interconnects202211,245,604Techniques to support multiple interconnect protocols for a common set of interconnect connectors202211,144,492Flex bus protocol negotiation and enabling sequence2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to INTEL CORP (16)· patent assignee history
2021–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 16 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 16 | 2021–2026 |