Inventor
ARUN VIRUPAKSHA GOWDA
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H05KPrinted circuits15%
H01RElectrically-conductive connections8%
H10DInorganic electric semiconductor devices8%
Y02PClimate change mitigation technologies in the production or processing of goods8%
PatentTitleYear
12,322,916Electronic connection assembly202512,237,243Power overlay module with thermal storage202512,034,033Semiconductor device package and method of forming202411,605,609Ultra-thin embedded semiconductor device package and method of manufacturing thereof202311,177,204Power electronics package and method of manufacturing thereof2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2023Patents assigned to GEN ELECTRIC (2)· patent assignee history
2021–2025Based in US· patent location history
2024–2025Patents assigned to GE AVIATION SYSTEMS LLC (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GE AVIATION SYSTEMS LLC | 3 | 2024–2025 |
| GEN ELECTRIC | 2 | 2021–2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2021–2025 |