Inventor
Yoon Gyung Cho
Inventor
Daejeon, KR
Overview
Patents· 43 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Kprimary
H10KOrganic electric solid-state devices15%
H01LSemiconductor devices14%
C09JAdhesives14%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients9%
Y10TTechnical subjects covered by former us classification8%
C08LCompositions of macromolecular compounds7%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds6%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
H05BElectric heating5%
PatentTitleYear
11,059,211Injection molding control method202110,752,814Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same202010,683,440Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same202010,647,890Adhesive composition, adhesive film comprising same, and organic electronic device comprising same202010,626,245Adhesive film and sealing product for organic electronic device using same202010,626,307Adhesive film202010,622,573Adhesive and method of encapsulating organic electronic device using the same202010,615,470Battery module202010,570,321Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same202010,457,842Curable composition201910,442,960Adhesive film and organic electronic device comprising the same201910,435,596Pressure-sensitive adhesive composition201910,392,536Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same201910,385,237Organic electronic device201910,351,738Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same201910,336,917Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same201910,308,842Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same201910,227,514Adhesive film201910,202,525Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same201910,141,543Method for manufacturing electronic device201810,125,292Adhesive film and product for encapsulating organic electronic device using same201810,103,353Encapsulation film and organic electronic device comprising the same201810,093,785Adhesive film and sealing product for organic electronic device using same201810,062,855Adhesive and method of encapsulating organic electronic device using the same201810,050,204Encapsulation composition (as amended)20189,966,562Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same20189,957,426Photocurable adhesive film for organic electronic device seal, organic electronic device and method for sealing same20189,923,169'Encapsulant film'20189,803,112'Pressure sensitive adhesive film and method of manufacturing organic electronic device using the same'20179,806,293'Encapsulation film'20179,768,386'Composition for encapsulation film, encapsulation film, and electronic device comprising the same'20179,698,374'Pressure sensitive adhesive film'20179,698,378'Encapsulation film'20179,698,379'Encapsulation film'20179,577,214'Adhesive film and method of encapsulating organic electronic device'20179,548,473'Method of evaluating reliable life span of encapsulant film and device for evaluating reliability of said film'20179,422,460'Adhesive film'20169,391,293'Adhesive film'20169,343,697'Adhesive film and sealing method for organic electronic device using same'20169,343,702'Adhesive film and method for encapsulating organic electronic device using same'20169,105,648'Adhesive and method of encapsulating organic electronic device using the same'20159,035,545'Organic light emitting device comprising encapsulating structure'20158,742,411'Adhesive film and method of encapsulating organic electrode device using the same'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2020Patents assigned to LG CHEMICAL LTD (42)· patent assignee history
2014–2020Based in Daejeon, KR· patent location history
2015Patents assigned to CHO YOON GYUNG (1)· patent assignee history
2015Patents assigned to JEONG KWANG JIN (1)· patent assignee history
2015Patents assigned to KANG MIN SOO (1)· patent assignee history
2021Patents assigned to DELTA ELECTRONICS INC (1)· patent assignee history
2021Based in Taoyuan, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LG CHEMICAL LTD | 42 | 2014–2020 |
| CHO YOON GYUNGself | 1 | 2015 |
| DELTA ELECTRONICS INC | 1 | 2021 |
| JEONG KWANG JIN | 1 | 2015 |
| KANG MIN SOO | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Daejeon, KR | 42 | 2014–2020 |
| Taoyuan, TW | 1 | 2021 |