Inventor

Sei Moriyasu

Inventor
Tokyo, JP

Overview

10→
Patents
1999–2008
Patent span
Performing operations
Primary field (CPC B)

Patents· 10 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing40%
B24DTools for grinding, buffing or sharpening13%
G01BMeasuring length, thickness or similar linear dimensions13%
G21KHandling of particles or ionising radiation not otherwise provided for13%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool7%
G05BControl or regulating systems in general7%
H05HPlasma technique7%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2001Patents assigned to RIKAGAKU KENKYUSHO (3)· patent assignee history
1999–2003Based in Tokyo, JP· patent location history
2002–2008Patents assigned to RIKEN (7)· patent assignee history
2002Patents assigned to NEXSYS CORP (1)· patent assignee history
2002Patents assigned to OHMORI HITOSHI (1)· patent assignee history
2003Patents assigned to SHIMADZU CORP (1)· patent assignee history
2008Based in Wako, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
RIKEN72002–2008
RIKAGAKU KENKYUSHO31999–2001
NEXSYS CORP12002
OHMORI HITOSHI12002
SHIMADZU CORP12003
Locations
LocationPatentsSpan
Tokyo, JP91999–2003
Wako, JP12008