Inventor
Kuo-Fang Huang
Inventor
Hsinchu, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices13%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems13%
H10BElectronic memory devices13%
H10DInorganic electric semiconductor devices13%
B01DSeparation6%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry6%
C01BNon-metallic elements6%
G09GArrangements or circuits for control of indicating devices using static means to present variable information6%
G11CStatic stores6%
H02JElectric power networks6%
PatentTitleYear
11,052,348Method for removing boron202110,868,017Memory structure and manufacturing method thereof202010,861,858Static random-access memory with capacitor which has finger-shaped protrudent portions and related fabrication method20209,825,547'Unidirectional isolated multi-level DC-DC converter and method thereof'20179,787,201'Bidirectional isolated multi-level DC-DC converter and method thereof'20177,345,380'Backup power supply system with a null transfer time'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2017Patents assigned to ABLEREX ELECTRONICS CO LTD (3)· patent assignee history
2008Based in Kaohsiung, TW· patent location history
2017Based in New Taipei, TW· patent location history
2020Patents assigned to POWERCHIP SEMICONDUCTOR MFG CORP (2)· patent assignee history
2020Patents assigned to POWERCHIP TECHNOLOGY CORP (1)· patent assignee history
2020–2021Based in Hsinchu, TW· patent location history
2021Patents assigned to IND TECH RES INST (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ABLEREX ELECTRONICS CO LTD | 3 | 2008–2017 |
| POWERCHIP SEMICONDUCTOR MFG CORP | 2 | 2020 |
| IND TECH RES INST | 1 | 2021 |
| POWERCHIP TECHNOLOGY CORP | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 3 | 2020–2021 |
| New Taipei, TW | 2 | 2017 |
| Kaohsiung, TW | 1 | 2008 |