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Inventor

Robert L. Beckman

Inventor
Beaverton, OR, US

Overview

4→
Patents
1987–1998
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

Y10Tprimary
Y10TTechnical subjects covered by former us classification29%
B29CShaping or joining of plastics14%
B29LIndexing scheme associated with subclass b29c, relating to particular articles14%
H01RElectrically-conductive connections14%
H05KPrinted circuits14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%
PatentTitleYear
5,792,988'Radio frequency heat sealing of cable assemblies'19985,789,725'Radio frequency heat sealing of cable assemblies'19984,774,127'Fabrication of a multilayer conductive pattern on a dielectric substrate'19884,650,545'Polyimide embedded conductor process'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–1988Patents assigned to TEKTRONIX INC (2)· patent assignee history
1987–1998Based in Beaverton, OR, US· patent location history
1998Patents assigned to WHITAKER CORP (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TEKTRONIX INC21987–1988
WHITAKER CORP21998
Locations
LocationPatentsSpan
Beaverton, OR, US41987–1998