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Inventor

Lee-Jen Wu

Inventor
Taipei, TW

Overview

5→
Patents
2002–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
G06FElectric digital data processing14%
G06KGraphical data reading14%
H01RElectrically-conductive connections14%
H04LTransmission of digital information, e.g. telegraphic communication14%
H04WWireless communication networks14%
PatentTitleYear
11,057,234Device control method and apparatus20217,004,770'Memory card connector with card ejector plate'20066,755,672'Connector protection cover structure'20046,542,369'Fixing frame for CPU cooling devices'20036,419,008'CPU cooling device with a mounting mechanism'2002

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2002–2004Patents assigned to NEXTRONICS ENGINEERING CORP (3)· patent assignee history
2002–2006Based in Taipei, TW· patent location history
2004Based in Hsichih, TW· patent location history
2006Patents assigned to MOLEX INC (1)· patent assignee history
2021Patents assigned to SHENZHEN ORVIBO TECHNOLOGY CO LTD (1)· patent assignee history
2021Based in Shenzhen, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NEXTRONICS ENGINEERING CORP32002–2004
MOLEX INC12006
SHENZHEN ORVIBO TECHNOLOGY CO LTD12021
Locations
LocationPatentsSpan
Taipei, TW32002–2006
Shenzhen, CN12021
Hsichih, TW12004