Inventor
Md Altaf Hossain
Inventor
Portland, OR, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
G06FElectric digital data processing20%
H01LSemiconductor devices20%
H03KPulse technique13%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use13%
H04LTransmission of digital information, e.g. telegraphic communication7%
PatentTitleYear
11,121,109Innovative interconnect design for package architecture to improve latency202111,080,449Modular periphery tile for integrated circuit device202111,070,209Programmable logic device with fine-grained disaggregation202111,056,452Interface bus for inter-die communication in a multi-chip package over high density interconnects2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to INTEL CORP (4)· patent assignee history
2021Based in Portland, OR, US· patent location history
2021Based in Santa Clara, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 4 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Portland, OR, US | 3 | 2021 |
| Santa Clara, California, US | 1 | 2021 |