Inventor
Anil K. Pant
Inventor
Santa Clara, CA, US
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing46%
B24DTools for grinding, buffing or sharpening14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
B23HWorking of metal by the action of a high concentration of electric current on a workpiece using an electrode which takes the place of a tool3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
G05BControl or regulating systems in general3%
G06NComputing arrangements based on specific computational models3%
G08BSignalling systems, e.g. personal calling systems3%
G10LSpeech analysis techniques or speech synthesis3%
PatentTitleYear
10,976,730Device for sound based monitoring of machine operations and method for operating the same20216,905,526'Fabrication of an ion exchange polish pad'20056,773,337'Method and apparatus to recondition an ion exchange polish pad'20046,722,950'Method and apparatus for electrodialytic chemical mechanical polishing and deposition'20046,656,025'Integrated pad and belt for chemical mechanical polishing'20036,425,812'Polishing head for chemical mechanical polishing using linear planarization technology'20026,416,385'Method and apparatus for polishing semiconductor wafers'20026,336,845'Method and apparatus for polishing semiconductor wafers'20026,328,642'Integrated pad and belt for chemical mechanical polishing'20016,325,706'Use of zeta potential during chemical mechanical polishing for end point detection'20016,224,461'Method and apparatus for stabilizing the process temperature during chemical mechanical polishing'20016,186,865'Apparatus and method for performing end point detection on a linear planarization tool'20016,132,289'Apparatus and method for film thickness measurement integrated into a wafer load/unload unit'20005,916,012'Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher'19995,871,390'Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing'19995,800,248'Control of chemical-mechanical polishing rate across a substrate surface'19985,762,536'Sensors for a linear polisher'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2003Patents assigned to LAM RES CORP (12)· patent assignee history
1998Patents assigned to ONTRAK SYSTEMS INC (1)· patent assignee history
1998–2003Based in Santa Cruz, CA, US· patent location history
2000–2005Based in Santa Clara, CA, US· patent location history
2004–2005Patents assigned to PLANAR LABS CORP (3)· patent assignee history
2021Patents assigned to DESHPANDE ANAND (1)· patent assignee history
2021Patents assigned to PANT ANIRUDDHA (1)· patent assignee history
2021Based in Pune, IN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 12 | 1998–2003 |
| PLANAR LABS CORP | 3 | 2004–2005 |
| DESHPANDE ANAND | 1 | 2021 |
| ONTRAK SYSTEMS INC | 1 | 1998 |
| PANT ANIRUDDHAself | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Santa Clara, California, US | 10 | 2000–2005 |
| Santa Cruz, California, US | 6 | 1998–2003 |
| Pune, IN | 1 | 2021 |