Inventor
Anastasios Angelopoulos
Inventor
Cincinnati, OH, US
Overview
16→
Patents
1999–2019
Patent span
General tagging of new technological developments
Primary field (CPC Y)
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification19%
H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy14%
H05KPrinted circuits14%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution14%
C23CCoating metallic material7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
B05DProcesses for applying fluent materials to surfaces, in general3%
B82YSpecific uses or applications of nanostructures3%
C08JWorking-up3%
PatentTitleYear
10,418,641High activity Pt--Bi catalyst for dimethyl ether electro-oxidation20199,640,805'Coating process for fuel cell components'20178,628,819'Method of depositing a nanoparticle coating on a bipolar plate and removing the nanoparticle coating from the lands of the bipolar plate'20148,435,627'Multifunctional nanocoatings with mixed nanoparticles and process for fabricating same'20138,227,076'Multifunctional nanocoatings and process for fabricating same'20127,892,596'Nanoparticle coating process for fuel cell components'20117,132,191'Addressing one MEA failure mode by controlling MEA catalyst layer overlap'20067,105,242'Control of polymer surface distribution on diffusion media improved fuel cell performance'20066,908,684'Promoting adhesion between a polymer and a metallic substrate'20056,730,409'Promoting adhesion between a polymer and a metallic substrate'20046,447,914'Method of uniformly depositing seed and a conductor and the resultant printed circuit structure'20026,136,513'Method of uniformly depositing seed and a conductor and the resultant printed circuit structure'20006,025,057'Organic electronic package and method of applying palladium-tin seed layer thereto'20005,997,997'Method for reducing seed deposition in electroless plating'19995,935,652'Method for reducing seed deposition in electroless plating'19995,866,237'Organic electronic package and method of applying palladium-tin seed layer thereto'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2005Patents assigned to IBM (8)· patent assignee history
1999–2002Based in Apalachin, NY, US· patent location history
2004–2005Based in Dunstable, MA, US· patent location history
2006Patents assigned to GEN MOTORS CORP (2)· patent assignee history
2006Based in Fairport, NY, US· patent location history
2011–2014Patents assigned to GM GLOBAL TECH OPERATIONS INC (2)· patent assignee history
2011–2019Based in Cincinnati, OH, US· patent location history
2012–2019Patents assigned to ANGELOPOULOS ANASTASIOS (5)· patent assignee history
2014–2017Patents assigned to PETERS SCOTT L (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 8 | 1999–2005 |
| ANGELOPOULOS ANASTASIOSself | 5 | 2012–2019 |
| GEN MOTORS CORP | 2 | 2006 |
| GM GLOBAL TECH OPERATIONS INC | 2 | 2011–2014 |
| PETERS SCOTT L | 2 | 2014–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Cincinnati, OH, US | 6 | 2011–2019 |
| Apalachin, New York, US | 6 | 1999–2002 |
| Fairport, New York, US | 2 | 2006 |
| Dunstable, Massachusetts, US | 2 | 2004–2005 |