Inventor
David A. Zoba
Inventor
Chandler, AZ, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1071%
Y10TTechnical subjects covered by former us classification29%
PatentTitleYear
6,919,631'Structures for improving heat dissipation in stacked semiconductor packages'20056,737,750'Structures for improving heat dissipation in stacked semiconductor packages'20046,650,019'Method of making a semiconductor package including stacked semiconductor dies'20036,603,072'Making leadframe semiconductor packages with stacked dies and interconnecting interposer'20036,472,758'Semiconductor package including stacked semiconductor dies and bond wires'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2005Patents assigned to AMKOR TECHNOLOGY INC (5)· patent assignee history
2002–2005Based in Chandler, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AMKOR TECHNOLOGY INC | 5 | 2002–2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 5 | 2002–2005 |