Inventor
Ranjith Kumar
Inventor
Beaverton, OR, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices18%
H04LTransmission of digital information, e.g. telegraphic communication18%
H10BElectronic memory devices18%
H10DInorganic electric semiconductor devices18%
G06FElectric digital data processing9%
H04WWireless communication networks9%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use9%
PatentTitleYear
10,847,635Vertical integration scheme and circuit elements architecture for area scaling of semiconductor devices202010,523,794Method and apparatus for managing multipath transmission control protocol201910,304,946Vertical integration scheme and circuit elements architecture for area scaling of semiconductor devices201910,203,882Method for managing multiple bandwidth boost solutions co-existing in an electronic device2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2020Patents assigned to INTEL CORP (2)· patent assignee history
2019Patents assigned to SAMSUNG ELECTRONICS CO LTD (2)· patent assignee history
2019–2020Based in Beaverton, OR, US· patent location history
2019Based in Bangalore, IN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 2 | 2019–2020 |
| SAMSUNG ELECTRONICS CO LTD | 2 | 2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beaverton, OR, US | 2 | 2019–2020 |
| Bangalore, IN | 2 | 2019 |