Inventor

Xinya Lei

Inventor
Boise, ID, US

Overview

9→
Patents
2010–2021
Patent span
Physics
Primary field (CPC G)

Patents· 9 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices47%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them20%
A47HFurnishings for windows or doors7%
E06BFixed or movable closures for openings in buildings, vehicles, fences or like enclosures in general, e.g. doors, windows, blinds, gates7%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010–2014Patents assigned to MICRON TECHNOLOGY INC (7)· patent assignee history
2010–2014Based in Boise, ID, US· patent location history
2011–2014Patents assigned to LEI XINYA (4)· patent assignee history
2011–2014Patents assigned to WANG FEI (4)· patent assignee history
2011–2012Patents assigned to BALUSWAMY PARY (2)· patent assignee history
2011Patents assigned to APTINA IMAGING CORP (1)· patent assignee history
2011Based in Sunnyvale, CA, US· patent location history
2021Based in Shenzhen, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MICRON TECHNOLOGY INC72010–2014
LEI XINYAself42011–2014
WANG FEI42011–2014
BALUSWAMY PARY22011–2012
APTINA IMAGING CORP12011
Locations
LocationPatentsSpan
Boise, ID, US72010–2014
Shenzhen, CN12021
Sunnyvale, California, US12011