Inventor
Ralph G. Nuzzo
Inventor
Champaign, IL, US
Overview
Patents· 45 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
B82YSpecific uses or applications of nanostructures9%
H10DInorganic electric semiconductor devices9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution8%
Y02PClimate change mitigation technologies in the production or processing of goods8%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems8%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation8%
H10HInorganic light-emitting semiconductor devices having potential barriers7%
H01LSemiconductor devices6%
PatentTitleYear
11,088,268Methods and devices for fabricating and assembling printable semiconductor elements202110,546,841Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays202010,504,882Optical systems fabricated by printing-based assembly201910,424,572Optical systems fabricated by printing-based assembly201910,374,072Methods and devices for fabricating and assembling printable semiconductor elements201910,361,180Optical systems fabricated by printing-based assembly201910,355,113Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics201910,073,293Optical microcavity for a high-contrast display20189,768,086'Methods and devices for fabricating and assembling printable semiconductor elements'20179,761,444'Methods and devices for fabricating and assembling printable semiconductor elements'20179,647,171'Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays'20179,601,671'Optical systems fabricated by printing-based assembly'20179,450,043'Methods and devices for fabricating and assembling printable semiconductor elements'20169,349,900'Release strategies for making transferable semiconductor structures, devices and device components'20169,324,733'Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics'20169,117,940'Optical systems fabricated by printing-based assembly'20159,105,782'Arrays of ultrathin silicon solar microcells'20159,045,657'Viscoelastic ink for direct writing of hydrogel structures'20158,895,406'Release strategies for making transferable semiconductor structures, devices and device components'20148,865,489'Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays'20148,729,524'Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics'20148,722,458'Optical systems fabricated by printing-based assembly'20148,679,888'Arrays of ultrathin silicon solar microcells'20148,664,699'Methods and devices for fabricating and assembling printable semiconductor elements'20148,440,546'Methods and devices for fabricating and assembling printable semiconductor elements'20138,394,706'Printable semiconductor structures and related methods of making and assembling'20138,252,191'Sub-micron decal transfer lithography'20128,217,381'Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics'20128,039,847'Printable semiconductor structures and related methods of making and assembling'20117,982,296'Methods and devices for fabricating and assembling printable semiconductor elements'20117,972,875'Optical systems fabricated by printing-based assembly'20117,943,491'Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp'20117,932,123'Release strategies for making transferable semiconductor structures, devices and device components'20117,909,971'Microfluidic electrochemical reactors'20117,799,699'Printable semiconductor structures and related methods of making and assembling'20107,705,280'Multispectral plasmonic crystal sensors'20107,662,545'Decal transfer lithography'20107,622,367'Methods and devices for fabricating and assembling printable semiconductor elements'20096,805,809'Decal transfer microfabrication'20046,518,168'Self-assembled monolayer directed patterning of surfaces'20034,716,050'Chemical vapor deposition of aluminum on an activated surface'19874,690,715'Modification of the properties of metals'19874,612,407'Aliphatic aromatization with intemetallic Group VIII-IIIA, IVA catalyst'19864,579,752'Enhanced corrosion resistance of metal surfaces'19864,507,401'Intermetallic catalyst preparation'1985Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1985–1987Based in Summit, NJ, US· patent location history
2003–2021Patents assigned to UNIV ILLINOIS (39)· patent assignee history
2003–2021Based in Champaign, IL, US· patent location history
2012–2014Patents assigned to ROGERS JOHN A (7)· patent assignee history
2012–2014Patents assigned to MEITL MATTHEW (6)· patent assignee history
2012–2014Patents assigned to MENARD ETIENNE (6)· patent assignee history
2012–2015Patents assigned to NUZZO RALPH G (6)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNIV ILLINOIS | 39 | 2003–2021 |
| ROGERS JOHN A | 7 | 2012–2014 |
| MEITL MATTHEW | 6 | 2012–2014 |
| MENARD ETIENNE | 6 | 2012–2014 |
| NUZZO RALPH Gself | 6 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Champaign, Illinois, US | 40 | 2003–2021 |
| Summit, New Jersey, US | 5 | 1985–1987 |