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Inventor

Keiichiro Tsutsumi

Inventor
Tokyo, JP

Overview

1→
Patents
2017
Patent span
Performing operations
Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering25%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems25%
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
PatentTitleYear
9,580,306'Room temperature bonding apparatus and room temperature bonding method'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017Patents assigned to MITSUBISHI HEAVY IND MACHINE TOOL CO LTD (1)· patent assignee history
2017Patents assigned to NAT INST ADVANCED IND SCIENCE & TECH (1)· patent assignee history
2017Based in Tokyo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MITSUBISHI HEAVY IND MACHINE TOOL CO LTD12017
NAT INST ADVANCED IND SCIENCE & TECH12017
Locations
LocationPatentsSpan
Tokyo, JP12017