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Inventor

Yoshiharu Tsuboi

Inventor
Yokohama, JP

Overview

5→
Patents
1993–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits25%
B23KSoldering or unsoldering8%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form8%
C03CChemical composition of glasses, glazes or vitreous enamels8%
C22CAlloys8%
E06BFixed or movable closures for openings in buildings, vehicles, fences or like enclosures in general, e.g. doors, windows, blinds, gates8%
PatentTitleYear
10,696,589Glass bonding material and multilayer glass20205,508,563'Semiconductor assembly having laminated semiconductor devices'19965,394,010'Semiconductor assembly having laminated semiconductor devices'19955,304,843'Semiconductor device using film carrier'19945,220,486'IC packing device'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–1996Patents assigned to TOSHIBA KK (4)· patent assignee history
1993–1994Based in Tokyo, JP· patent location history
1995–1996Based in Yokohama, JP· patent location history
2020Patents assigned to HITACHI METALS LTD (1)· patent assignee history
2020Based in Suita, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOSHIBA KK41993–1996
HITACHI METALS LTD12020
Locations
LocationPatentsSpan
Yokohama, JP21995–1996
Tokyo, JP21993–1994
Suita, JP12020