Inventor

WEN-HSIUNG CHANG

Inventor

Overview

3→

Patents

2022–2025

Patent span

Electricity

Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices29%

H10BElectronic memory devices14%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation14%

H10NElectric solid-state devices not otherwise provided for14%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%

PatentTitleYear

12,439,609Process technique for embedded memory2025 11,522,000Semiconductor package structure and manufacturing method thereof2022 11,309,296Semiconductor package and manufacturing method thereof2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022Patents assigned to POWERTECH TECHNOLOGY INC (2)· patent assignee history

2022Based in TW· patent location history

2025Patents assigned to HEFEI RELIANCE MEMORY LTD (1)· patent assignee history

2025Based in CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
POWERTECH TECHNOLOGY INC	2	2022
HEFEI RELIANCE MEMORY LTD	1	2025

Locations

Location	Patents	Span
TW	2	2022
CN	1	2025