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Inventor

Masahiko Furuno

Inventor
Tokyo, JP

Overview

4→
Patents
2004–2012
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering25%
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
F27BFurnaces, kilns, ovens or retorts in general6%
F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace6%
PatentTitleYear
8,104,661'Heating device, reflow device, heating method, and bump forming method'20128,042,727'Heater, reflow apparatus, and solder bump forming method and apparatus'20117,350,686'Method for supplying solder'20086,742,701'Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2012Patents assigned to TAMURA SEISAKUSHO KK (4)· patent assignee history
2004Based in Iruma, JP· patent location history
2008–2011Patents assigned to JAPAN SCIENCE & TECH AGENCY (2)· patent assignee history
2008–2012Based in Tokyo, JP· patent location history
2012Patents assigned to FURUNO MASAHIKO (1)· patent assignee history
2012Patents assigned to ONOZAKI JUNICHI (1)· patent assignee history
2012Patents assigned to SAITO HIROSHI (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAMURA SEISAKUSHO KK42004–2012
JAPAN SCIENCE & TECH AGENCY22008–2011
FURUNO MASAHIKOself12012
ONOZAKI JUNICHI12012
SAITO HIROSHI12012
Locations
LocationPatentsSpan
Tokyo, JP32008–2012
Iruma, JP12004