Inventor
Tadashi Arikawa
Inventor
Toyama, JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
B22FWorking metallic powder21%
C22CAlloys17%
H05KPrinted circuits10%
Y10TTechnical subjects covered by former us classification7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
C22FChanging the physical structure of non-ferrous metals and non-ferrous alloys3%
C23CCoating metallic material3%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
H01LSemiconductor devices3%
PatentTitleYear
10,215,512Heat spreader and method for manufacturing the same20197,547,412'Composite material, method for producing same and member using same'20097,083,759'Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions'20066,926,861'Semiconductor package and method for producing heat-radiating substrate for it'20056,693,353'Semiconductor package and method for producing heat-radiating substrate for it'20046,475,429'Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same'20026,271,585'Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same'20015,493,153'Plastic-packaged semiconductor device having a heat sink matched with a plastic package'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–2005Patents assigned to TOKYO TUNGSTEN KK (5)· patent assignee history
1996–2019Based in Toyama, JP· patent location history
2006–2019Patents assigned to ALMT CORP (3)· patent assignee history
2009Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO TUNGSTEN KK | 5 | 1996–2005 |
| ALMT CORP | 3 | 2006–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Toyama, JP | 7 | 1996–2019 |
| Tokyo, JP | 1 | 2009 |