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Inventor

Taishi Wakabayashi

Inventor
Nagano, JP

Overview

4→
Patents
2019–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
H10DInorganic electric semiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
PatentTitleYear
10,763,127Heat treatment method for semiconductor wafer202010,566,196Method for manufacturing bonded SOI wafer202010,529,615Method for manufacturing a bonded SOI wafer and bonded SOI wafer202010,460,983Method for manufacturing a bonded SOI wafer2019

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019–2020Patents assigned to SHINETSU HANDOTAI KK (4)· patent assignee history
2019–2020Based in Nagano, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
SHINETSU HANDOTAI KK42019–2020
Locations
LocationPatentsSpan
Nagano, JP42019–2020