Inventor
PATRICK A. VAN CLEEMPUT
Inventor
US
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
C23CCoating metallic material20%
H01LSemiconductor devices20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H10BElectronic memory devices9%
H01JElectric discharge tubes or discharge lamps6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
12,553,131Deposition of molybdenum202612,474,640Integration of dry development and etch processes for EUV patterning in a single process chamber202512,351,914Deposition of films using molybdenum precursors202512,334,351Molybdenum deposition202512,327,762Molybdenum fill202512,203,168Metal deposition202512,148,623Deposition of tungsten on molybdenum templates202412,112,980Method to create air gaps202412,074,029Molybdenum deposition202412,051,589Tin oxide thin film spacers in semiconductor device manufacturing202411,970,776Atomic layer deposition of metal films202411,784,047Tin oxide thin film spacers in semiconductor device manufacturing202311,270,896Apparatus for UV flowable dielectric2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to LAM RES CORP (13)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 13 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 13 | 2022–2026 |