Inventor

Vivek Amir Jairazbhoy

Inventor

Farmington Hills, MI, US

Overview

48→

Patents

1994–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 48 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits27%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%

Y02PClimate change mitigation technologies in the production or processing of goods12%

Y10TTechnical subjects covered by former us classification12%

B23KSoldering or unsoldering7%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution4%

B60LPropulsion of electrically-propelled vehicles3%

H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy3%

Y02TClimate change mitigation technologies related to transportation3%

B41FPrinting machines or presses2%

PatentTitleYear

10,396,411Traction battery thermal plate with transverse channel configuration2019 9,931,908HVAC air inlet with blend mode and fresh-restricted mode2018 9,452,683'Traction battery thermal plate with longitudinal channel configuration'2016 9,368,845'Traction battery thermal plate with multi pass channel configuration'2016 8,535,002'HVAC diffuser with mounting receptacle for variable blower control'2013 8,197,203'Air diffuser for a HVAC system'2012 7,669,789'Low pressure fuel injector nozzle'2010 7,023,699'Liquid cooled metal thermal stack for high-power dies'2006 6,998,540'Electrical circuit board and a method for making the same'2006 6,992,887'Liquid cooled semiconductor device'2006 6,977,346'Vented circuit board for cooling power components'2005 6,914,357'Electric machine with integrated power electronics'2005 6,826,829'Method for attaching a die with a low melting metal'2004 6,613,239'Method for making an electrical circuit board'2003 6,601,753'Void-free die attachment method with low melting metal'2003 6,584,682'Method for making circuit board'2003 6,585,903'Electrical circuit board and a method for making the same'2003 6,467,161'Method for making a circuit board'2002 6,449,839'Electrical circuit board and a method for making the same'2002 6,405,920'Enhanced mounting pads for printed circuit boards'2002 6,395,087'Method and apparatus for dispensing viscous material'2002 6,391,211'Method for making an electrical circuit board'2002 6,381,837'Method for making an electronic circuit assembly'2002 6,361,606'Method and apparatus for dispensing viscous material'2002 6,316,736'Anti-bridging solder ball collection zones'2001 6,303,872'Anti-tombstoning solder joints'2001 6,303,992'Interposer for mounting semiconductor dice on substrates'2001 6,274,407'Method and article for attaching high-operating-temperature electronic component'2001 6,169,253'Solder resist window configurations for solder paste overprinting'2001 6,144,104'High-operating-temperature electronic component'2000 6,115,262'Enhanced mounting pads for printed circuit boards'2000 6,073,817'Pneumatically-actuated throttle valve for molten solder dispenser'2000 6,059,020'Apparatus for acoustic cooling automotive electronics'2000 6,049,466'Substrate with embedded member for improving solder joint strength'2000 6,000,597'Molten solder dispensing system'1999 5,986,884'Method for cooling electronic components'1999 5,936,846'Optimized solder joints and lifter pads for improving the solder joint life of surface mount chips'1999 5,931,371'Standoff controlled interconnection'1999 5,878,661'Self-shearing stencil'1999 5,842,275'Reflow soldering to mounting pads with vent channels to avoid skewing'1998 5,792,677'Embedded metal planes for thermal management'1998 5,746,368'Molten solder dispensing system'1998 5,703,290'Bobbin assembly for a vehicle instrument gauge'1997 5,685,475'Apparatus for cooling printed circuit boards in wave soldering'1997 5,669,813'Apparatus for storing and cooling electronic devices and/or modules in a vehicle'1997 5,663,529'Anti-skew mounting pads and processing method for electronic surface mount components'1997 5,639,013'Optimally shaped solder joints for improved reliability and space savings'1997 5,320,273'Gas flow distribution system for molten solder dispensing process'1994

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1994–2000Patents assigned to FORD MOTOR CO (16)· patent assignee history

1994–2019Based in Farmington Hills, MI, US· patent location history

2001–2010Patents assigned to VISTEON GLOBAL TECH INC (22)· patent assignee history

2012–2018Patents assigned to JAIRAZBHOY VIVEK A (3)· patent assignee history

2012–2013Patents assigned to AUTOMOTIVE COMPONENTS HOLDINGS (2)· patent assignee history

2016–2019Patents assigned to FORD GLOBAL TECH LLC (4)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
VISTEON GLOBAL TECH INC	22	2001–2010
FORD MOTOR CO	16	1994–2000
FORD GLOBAL TECH LLC	4	2016–2019
JAIRAZBHOY VIVEK Aself	3	2012–2018
AUTOMOTIVE COMPONENTS HOLDINGS	2	2012–2013

Locations

Location	Patents	Span
Farmington Hills, MI, US	48	1994–2019