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Inventor

Shy-Huey Yee

Inventor
New Taipei, TW

Overview

4→
Patents
2017–2018
Patent span
Performing operations
Primary field (CPC B)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics36%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering36%
A23PShaping or working of foodstuffs, not fully covered by a single other subclass18%
B29LIndexing scheme associated with subclass b29c, relating to particular articles9%
PatentTitleYear
9,895,872'Three-dimensional printing apparatus'20189,854,829'Three-dimensional printing method'20189,839,234'Three-dimensional printing device'20179,630,362'Printing head module'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017–2018Patents assigned to KINPO ELECT INC (4)· patent assignee history
2017–2018Patents assigned to XYZPRINTING INC (4)· patent assignee history
2017–2018Patents assigned to CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LTD (3)· patent assignee history
2017–2018Based in New Taipei, TW· patent location history
2017Based in Singapore, SG· patent location history
2018Patents assigned to CAL COMP ELECTRONICS & COMMUNICATIONS COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KINPO ELECT INC42017–2018
XYZPRINTING INC42017–2018
CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LTD32017–2018
CAL COMP ELECTRONICS & COMMUNICATIONS COMPANY LTD12018
Locations
LocationPatentsSpan
New Taipei, TW32017–2018
Singapore, SG12017