Inventor
Joseph K. Fauty
Inventor
Mesa, AZ, US
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1076%
Y10TTechnical subjects covered by former us classification8%
B23KSoldering or unsoldering4%
H05KPrinted circuits4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
Y02PClimate change mitigation technologies in the production or processing of goods4%
PatentTitleYear
8,319,323'Electronic package having down-set leads and method'20128,253,239'Multi-chip semiconductor connector'20127,901,990'Method of forming a molded array package device having an exposed tab and structure'20117,875,964'Multi-chip semiconductor connector and method'20117,820,528'Method of forming a leaded molded array package'20107,656,048'Encapsulated chip scale package having flip-chip on lead frame structure'20107,602,054'Method of forming a molded array package device having an exposed tab and structure'20097,598,123'Semiconductor component and method of manufacture'20097,588,999'Method of forming a leaded molded array package'20097,508,060'Multi-chip semiconductor connector assemblies'20097,498,195'Multi-chip semiconductor connector assembly method'20097,439,100'Encapsulated chip scale package having flip-chip on lead frame structure and method'20087,298,034'Multi-chip semiconductor connector assemblies'20077,202,106'Multi-chip semiconductor connector and method'20077,202,105'Multi-chip semiconductor connector assembly method'20077,109,064'Method of forming a semiconductor package and leadframe therefor'20066,768,186'Semiconductor device and laminated leadframe package'20046,164,523'Electronic component and method of manufacture'20006,081,031'Semiconductor package consisting of multiple conductive layers'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2012Patents assigned to SEMICONDUCTOR COMPONENTS IND (19)· patent assignee history
2000–2012Based in Mesa, AZ, US· patent location history
2012Patents assigned to FAUTY JOSEPH K (2)· patent assignee history
2012Patents assigned to YODER JAY A (2)· patent assignee history
2012Patents assigned to BURGHOUT WILLIAM F (1)· patent assignee history
2012Patents assigned to CARNEY FRANCIS J (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SEMICONDUCTOR COMPONENTS IND | 19 | 2000–2012 |
| FAUTY JOSEPH Kself | 2 | 2012 |
| YODER JAY A | 2 | 2012 |
| BURGHOUT WILLIAM F | 1 | 2012 |
| CARNEY FRANCIS J | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Mesa, AZ, US | 19 | 2000–2012 |