Inventor

DER-CHYANG YEH

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 76 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices37%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1037%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%

H10DInorganic electric semiconductor devices4%

H10HInorganic light-emitting semiconductor devices having potential barriers2%

H05KPrinted circuits2%

H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light0%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation0%

PatentTitleYear

12,599,029Package structure and method of forming the same2026 12,575,433Semiconductor package and method of manufacturing the same2026 12,557,698Package and manufacturing method thereof2026 12,431,417Semiconductor package and method of manufacturing the same2025 12,394,758Packages with metal line crack prevention design2025 12,368,280Semiconductor device and method2025 12,347,749Semiconductor packages2025 12,341,104Methods of manufacturing semiconductor devices2025 12,327,819Devices employing thermal and mechanical enhanced layers and methods of forming same2025 12,327,815Integrated circuit package and method of forming the same2025 12,322,726Method of forming an integrated circuit package having a padding layer on a carrier2025 12,211,782Semiconductor package dielectric susbtrate including a trench2025 12,191,224Semiconductor package and manufacturing method thereof2025 12,170,207Stacked semiconductor devices and methods of forming same2024 12,159,853Package structure including IPD and method of forming the same2024 12,142,524Via for component electrode connection2024 12,087,745Package structure and manufacturing method thereof2024 12,062,602Semiconductor package and method of manufacturing the same2024 12,051,616Wafer level chip scale packaging intermediate structure apparatus and method2024 12,033,949Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structure2024 12,020,953Fan-out structure and method of fabricating the same2024 12,009,335Structure and method of forming a joint assembly2024 11,984,405Pad structure design in fan-out package2024 11,961,796Semiconductor package dielectric substrate including a trench2024 11,961,800Via for semiconductor device connection and methods of forming the same2024 11,955,401Package structure2024 11,935,836Semiconductor devices2024 11,862,606Packages with metal line crack prevention design2024 11,854,994Redistribution structure for integrated circuit package and method of forming same2023 11,848,271Redistribution layer structures for integrated circuit package2023 11,842,983Semiconductor structure2023 11,837,587Package structure and manufacturing method thereof2023 11,823,912Stacked semiconductor devices and methods of forming same2023 11,804,475Semiconductor package for thermal dissipation2023 11,742,298Alignment mark design for packages2023 11,728,249Semiconductor package and method2023 11,721,559Integrated circuit package pad and methods of forming2023 11,715,727Packages and methods of forming packages2023 11,682,654Semiconductor structure having a sensor device and method of manufacturing the same2023 11,664,322Multi-stacked package-on-package structures2023 11,652,063Semiconductor package and method of forming the same2023 11,646,220Raised via for terminal connections on different planes2023 11,631,611Wafer level chip scale packaging intermediate structure apparatus and method2023 11,626,296Fan-out structure and method of fabricating the same2023 11,626,341Package structure2023 11,612,057Opening in the pad for bonding integrated passive device in InFO package2023 11,594,520Semiconductor package for thermal dissipation2023 11,587,900Package structure including IPD and method of forming the same2023 11,581,250Package with metal-insulator-metal capacitor and method of manufacturing the same2023 11,532,567Electric magnetic shielding structure in packages2022 11,515,229Semiconductor package and manufacturing method thereof2022 11,508,695Redistribution layers in semiconductor packages and methods of forming same2022 11,502,032Chip package and method of fabricating the same2022 11,482,497Package structure including a first die and a second die and a bridge die and method of forming the package structure2022 11,470,720Opening in the pad for bonding integrated passive device in InFO package2022 11,469,138Via for coupling attached component upper electrode to substrate2022 11,469,218Devices employing thermal and mechanical enhanced layers and methods of forming same2022 11,450,612Semiconductor devices and methods of manufacturing the same2022 11,444,034Redistribution structure for integrated circuit package and method of forming same2022 11,444,057Package structures and methods of forming2022 11,444,020Via for semiconductor device connection and methods of forming the same2022 11,430,670Stacked semiconductor devices and methods of forming same2022 11,424,189Pad structure design in fan-out package2022 11,373,969Semiconductor package and method of forming the same2022 11,355,468Structure and method of forming a joint assembly2022 11,342,196Integrated circuit package pad and methods of forming2022 11,335,658Multi-chip package and method of formation2022 11,289,398Package structure and manufacturing method thereof2022 11,251,071Raised via for terminal connections on different planes2022 11,217,570Package structure and manufacturing method thereof2022 11,201,142Semiconductor package, package on package structure and method of froming package on package structure2021 11,189,603Semiconductor packages and methods of forming same2021 11,177,238Semiconductor structure2021 11,177,142Method for dicing integrated fan-out packages without seal rings2021 11,158,619Redistribution layers in semiconductor packages and methods of forming same2021 11,152,323Package with UBM and methods of forming2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (75)· patent assignee history

2021–2026Based in TW· patent location history

2026Patents assigned to TAIWAN SEMICONDUCTOR MFG COMPANY LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	75	2021–2026
TAIWAN SEMICONDUCTOR MFG COMPANY LTD	1	2026

Locations

Location	Patents	Span
TW	76	2021–2026