Inventor
STEVEN T. MAYER
Inventor
US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C25Dprimary
C25DProcesses for the electrolytic or electrophoretic production of coatings26%
H01LSemiconductor devices23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
C25FProcesses for the electrolytic removal of materials from objects6%
C23FNon-mechanical removal of metallic material from surface3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
PatentTitleYear
12,559,853Differential contrast plating for advanced packaging applications202612,392,047Byproduct removal from electroplating solutions202512,305,307TSV process window and fill performance enhancement by long pulsing and ramping202512,293,943Gold through silicon mask plating202512,241,173Wafer shielding for prevention of lipseal plate-out202511,610,782Electro-oxidative metal removal in through mask interconnect fabrication202311,549,192Electroplating apparatus for tailored uniformity profile202311,542,630Cleaning electroplating substrate holders using reverse current deplating2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to LAM RES CORP (6)· patent assignee history
2023Patents assigned to NOVELLUS SYSTEMS INC (2)· patent assignee history
2023–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 6 | 2023–2026 |
| NOVELLUS SYSTEMS INC | 2 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 8 | 2023–2026 |