Inventor
TOMOKO HIGASHIUCHI
Inventor
JP
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds31%
C08LCompositions of macromolecular compounds22%
C08JWorking-up19%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients13%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%
C09KMaterials for miscellaneous applications, not provided for elsewhere6%
H05KPrinted circuits3%
PatentTitleYear
12,104,009Epoxy resin, epoxy resin composition, epoxy resin cured product and method of producing epoxy resin cured product, composite material, insulating member, electronic appliance, structural material, and vehicle202412,049,538Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material202411,919,995Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material202411,840,600Cured epoxy resin material, epoxy resin composition, molded article, and composite material202311,661,475Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material202311,560,476Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material202311,535,700Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturing202211,466,119Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material202211,440,990Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material202211,352,562Epoxy resin, epoxy resin composition, epoxy resin cured product and composite material2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to SHOWA DENKO MATERIALS CO LTD (7)· patent assignee history
2022–2024Based in JP· patent location history
2023–2024Patents assigned to RESONAC CORP (4)· patent assignee history
2023Patents assigned to HITACHI CHEMICAL CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHOWA DENKO MATERIALS CO LTD | 7 | 2022–2024 |
| RESONAC CORP | 4 | 2023–2024 |
| HITACHI CHEMICAL CO LTD | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 10 | 2022–2024 |