Inventor

Shuai GUO

Inventor
CN

Overview

28→
Patents
2021–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 28 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices17%
H10BElectronic memory devices17%
H10DInorganic electric semiconductor devices12%
LOC1412%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
Y02PClimate change mitigation technologies in the production or processing of goods3%
B25JManipulators2%
C23CCoating metallic material2%
PatentTitleYear
12,520,620Solar battery, method for preparing same and use thereof202612,513,885Method for forming semiconductor device and semiconductor device2025D1107698Computer mainframe2025D1089184Laptop computer2025D1089215Computer mainframe202512,369,429All-black crystalline silicon solar cell and preparation method therefor, and photovoltaic module202512,317,503Memory device, and manufacturing method and driving method thereof202512,302,549Semiconductor memory structure202512,262,522Method for fabricating semiconductor structure, semiconductor structure, and memory202512,237,433Double-sided solar cell and preparation method therefor202512,218,220Manufacturing method of semiconductor structure and semiconductor structure202512,051,608Method for adjusting wafer deformation and semiconductor structure202412,046,472Method for manufacturing semiconductor structure202412,014,994Method for forming overlay marks and semiconductor structure2024D1030756Head mounted display device2024D1028978Head mounted display device202411,935,785Method of manufacturing a semiconductor structure, and a semiconductor structure202411,864,371Method for manufacturing semiconductor structure and semiconductor structure2024D1001811Computer mainframe202311,778,804Capacitor array structure and fabrication method thereof202311,711,153Wireless signal performance adjustment apparatus and method and wireless communication terminal202311,626,408Memory device and forming method thereof202311,587,949Method of manufacturing semiconductor structure and semiconductor structure202311,508,731Semiconductor structure and manufacturing method thereof202211,342,185Wafer bonding method and structure thereof2022D0945402Earphone2022D0940073Earphone charging box202211,196,236Climbing robot traveling along overhead line2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021Patents assigned to QINGDAO SHARING INTELLIGENT MFG CO LTD (1)· patent assignee history
2021–2026Based in CN· patent location history
2022–2025Patents assigned to CHANGXIN MEMORY TECH INC (14)· patent assignee history
2022Patents assigned to MOBVOI INFORMATION TECH COMPANY LIMITED (2)· patent assignee history
2023–2025Patents assigned to LENOVO BEIJING LTD (6)· patent assignee history
2025–2026Patents assigned to HENGDIAN GROUP DMEGC MAGNETICS CO LTD (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHANGXIN MEMORY TECH INC142022–2025
LENOVO BEIJING LTD62023–2025
HENGDIAN GROUP DMEGC MAGNETICS CO LTD32025–2026
MOBVOI INFORMATION TECH COMPANY LIMITED22022
QINGDAO SHARING INTELLIGENT MFG CO LTD12021
Locations
LocationPatentsSpan
CN282021–2026