Inventor

Mark R. Schneider

Inventor

San Jose, CA, US

Overview

1976–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 55 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%

A61BDiagnosis9%

G01SRadio direction-finding9%

Y10TTechnical subjects covered by former us classification9%

H05KPrinted circuits8%

Y02PClimate change mitigation technologies in the production or processing of goods4%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%

A41DOuterwear2%

A61FFilters implantable into blood vessels2%

PatentTitleYear

10,779,892Tracking a cylindrical opening2020 10,605,904Systems and methods of wireless position tracking2020 10,534,067Radio frequency communication system2020 10,416,276Position tracking system and method using radio signals and inertial sensing2019 10,338,192Radio frequency communication system2019 10,234,539Cycling reference multiplexing receiver system2019 10,180,490Radio frequency communication system2019 9,945,940Systems and methods of wireless position tracking2018 8,957,812'Position tracking system and method using radio signals and inertial sensing'2015 8,942,780'DC magnetic-based position and orientation monitoring system for tracking medical instruments'2015 8,228,028'Systems and methods for compensating for large moving objects in magnetic-tracking environments'2012 8,170,824'System and method for determining distance with precision in the presence of multipath interference'2012 8,170,830'Method and system for providing tolerance to interference and obstructions of line of sight'2012 7,835,785'DC magnetic-based position and orientation monitoring system for tracking medical instruments'2010 7,788,060'System and method for measuring position and orientation using distortion-compensated magnetic fields'2010 7,373,271'System and method for measuring position and orientation using distortion-compensated magnetic fields'2008 6,427,079'Position and orientation measuring with magnetic fields'2002 6,073,043'Measuring position and orientation using magnetic fields'2000 5,963,795'Method of assembling a heat sink assembly'1999 5,900,670'Stackable heatsink structures for semiconductor devices'1999 5,888,847'Technique for mounting a semiconductor die'1999 5,885,848'Ball grid array with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom'1999 5,869,891'Powdered metal heat sink with increased surface area'1999 5,869,778'Powder metal heat sink for integrated circuit devices'1999 5,814,536'Method of manufacturing powdered metal heat sinks having increased surface area'1998 5,789,813'Ball grid array package with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom'1998 5,780,928'Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices'1998 5,773,886'System having stackable heat sink structures'1998 5,744,171'System for fabricating conductive epoxy grid array semiconductor packages'1998 5,729,894'Method of assembling ball bump grid array semiconductor packages'1998 5,728,599'Printable superconductive leadframes for semiconductor device assembly'1998 5,693,981'Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system'1997 5,654,587'Stackable heatsink structure for semiconductor devices'1997 5,644,143'Method for protecting a semiconductor device with a superconductive line'1997 5,639,696'Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array'1997 5,610,442'Semiconductor device package fabrication method and apparatus'1997 5,593,918'Techniques for forming superconductive lines'1997 5,572,069'Conductive epoxy grid array semiconductor packages'1996 5,552,634'Method and apparatus for dissipating heat in an electronic device'1996 5,514,327'Powder metal heat sink for integrated circuit devices'1996 5,504,374'Microcircuit package assembly utilizing large size die and low temperature curing organic die attach material'1996 5,410,806'Method for fabricating conductive epoxy grid array semiconductors packages'1995 5,405,808'Fluid-filled and gas-filled semiconductor packages'1995 5,311,060'Heat sink for semiconductor device assembly'1994 5,265,669'Tying neckband heat transfer device'1993 5,175,612'Heat sink for semiconductor device assembly'1992 5,172,301'Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same'1992 5,104,827'Method of making a plastic-packaged semiconductor device having lead support and alignment structure'1992 5,088,549'Tying neckband heat transfer device'1992 5,051,813'Plastic-packaged semiconductor device having lead support and alignment structure'1991 4,229,936'Low-cost watch case and band'1980 4,182,020'Method of manufacturing a battery cover for placement in an opening in a battery container'1980 4,167,850'Electronic watch apparatus'1979 4,077,200'Case for an electronic wristwatch module'1978 3,947,867'Two part package for a semiconductor die'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976–1999Based in San Jose, CA, US· patent location history

1978–1980Patents assigned to FAIRCHILD CAMERA INSTR CO (4)· patent assignee history

1991–1999Patents assigned to LSI LOGIC CORP (30)· patent assignee history

1992–1993Based in Orlando, FL, US· patent location history

1993–2015Patents assigned to SCHNEIDER MARK R (3)· patent assignee history

2000–2020Based in Williston, VT, US· patent location history

2008–2015Patents assigned to ASCENSION TECH CORP (5)· patent assignee history

2015–2020Patents assigned to POSITION IMAGING INC (8)· patent assignee history

2019Based in Wiliston, VT, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
LSI LOGIC CORP	30	1991–1999
POSITION IMAGING INC	8	2015–2020
ASCENSION TECH CORP	5	2008–2015
FAIRCHILD CAMERA INSTR CO	4	1978–1980
SCHNEIDER MARK Rself	3	1993–2015

Locations

Location	Patents	Span
San Jose, California, US	35	1976–1999
Williston, VT, US	17	2000–2020
Orlando, Florida, US	2	1992–1993
Wiliston, VT, US	1	2019